I took the aluminium off a frozen lasagna to make an I/O shield but decided to glue some cardboard on the side you can see on the outside of the case to make it thicker/stronger. Does anyone think this is a mistake? Should I take off the cardboard? Will it stop it from grounding the motherboard?
I agree with Shep . . . Sheep . .
If you are inclined as I to pressurize your case, having no I/O plate is a drawback.
Otherwise, it would seem like a lot of trouble for NADA. But I admire your resourcefulness in picking "junk" materials. Aluminum from a Lasagna package! I never thought of that one . . .
If there are gaping holes around your I/O ports, you might try adhesive aluminum tape from an auto-parts store, but that, too, is messy. It's just too much tedium and trouble with little advantage.