LGA775 Thermal Coupound Placement

LouPoir

Lifer
Mar 17, 2000
11,201
126
106
You know, I have finally come to the conclusion that the top of the LGA processors is not flat. You need to put some extra AS5 in the middle. This is the second processor I have been fighting heat problems with. The first was my 3.8 and now the 3.0 dual core.

With the typical placement of a thin layer of AS5, my temps at full load with the PentD 3.0 at 3.8 at default vCore was hovering at 80c. Wowie. That's with the Big Typhon cooling.

I re-applied AS5 with special attention to the middle - 3x the extra AS5 in the middle and now temps are hovering at 53c full load.

Damm Intel bastards.


Lou
 

Jeff7181

Lifer
Aug 21, 2002
18,368
11
81
This is one reason they say to apply the compound to the middle of the heatspreader and not to spread it yourself.