LGA 775 heat sink installation

[freeflyer]

I'm putting together my first LGA 775 based system and got a Asus P5VD1-X and boxed Intel processor. Intel's instructions say to install the m/b in the case before installing heatsink, and then just push clips until they pop. It became very clear that the amount of force required to seat the clips would be way too much flex on the motherboard in that scenario so I took the m/b out and looked at it. If I fully seat all 4 clips, the m/b is visibly pushed out - convex - on the underside below the processor. This doesn't seem right nor healthy for the life of the m/b.

So the question is, is this normal? Or is there a problem with this m/b? Or the heatsink?

I have the processor correctly installed, I've booted from it and the BIOS is happy with things. It ran the Windows memory diagnostic overnight without errors. So the issue isn't processor installation.

 

[elecrzy]

 

[elecrzy]

yes, its normal for the motherboard to flex after the HSF installation. Its also important to check if all four clips are totally seated. Otherwise, you'll run into overheating problems from a bad install.

 

[Gstanfor]

Don't know much about intel systems - I specialise in AMD, but shouldn't there be a metal or plastic backing plate behind the CPU socket to relieve the stress? Of course, knowing intel I wouldn't be suprised if there wasn't - charge a fortune for nothing - that's their motto.

 

[Stumps]

YES it is common to see a slight bend in the board around the HSF when it is installed, they do go down with a lot of pressure, you shouldn't have any problems.

 

[freeflyer]

Thanks everyone. Got all 4 clips seated now and things are still happy.