So I know lapping makes the surface of the IHS or heat sink smooth, but how do you know the lapping job is level?
Not sure if this has any impact at all on the temp reduction one can achieve, but it's worth asking IMO.
Also, what would be the best way of spreading thermal paste once lapping on both IHS and heatsink is done? I've heard that thinner is better, especially for lapped surfaces. This makes me think that the procedure shown on the AS site is incorrect, being that too much compound is being applied. What do you guys think?
Not sure if this has any impact at all on the temp reduction one can achieve, but it's worth asking IMO.
Also, what would be the best way of spreading thermal paste once lapping on both IHS and heatsink is done? I've heard that thinner is better, especially for lapped surfaces. This makes me think that the procedure shown on the AS site is incorrect, being that too much compound is being applied. What do you guys think?