Lapping job was borked

[tigersty1e]

So I lapped the Zalman VF 700 and while it is smooth and flat... the angle is not parallel to the mounting bracket.


So imagine 2 lines..

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Now tilt the second line a few degrees. That's how it looks now. I'm thinking it's fine because the surface is flat and smooth, but how bad is the tilt?

 

[Burrich]

Being perfectly perpendicular shouldn't matter. The only thing you've barely affected is the amount of volume for use in heat dissipation. Shouldn't be a big deal.

 

[Idontcare]

Agreed...so long as your HSF "leaning tower of Pisa" does not cause the top portion to be so far out of alignment that it is contacting something else in the case (PSU or the case itself) or truly disrupting the airflow in the case then it's really just a superficial flaw.

What matters is that the compression placed on the HSF bracket and the motherboard is sufficient to mate the HSF and IHS surfaces uniformly across the entire area of contact...springs do this quite nicely.

 

[M1A]

So how did you get that much off the HS? Is it really that bad? Like they said if its flat it should work.