I see it as a matter of R&D expenditures in making different die configurations.
The 7000 series was mostly GCN 1.0 with just 1 GCN 1.1 SKU (7790). Competition from AMD in the dGPU space was good at that time, even with NV going full offense with their PR force exploiting the crossfire smoothness issues.
In the other hand, the 200 was only comprised of 2 new die configurations, one GCN 1.1 (Hawaii) and one GCN 1.2 (285), while the rest of the lineup was still rebrands of 7000 series. Here is when NV started this big swing in marketshare, filling more gaps with cut down dies than AMD (NV had 3 SKU variations per die at the top end than AMD which only sports 2 historically). NV didnt actually had a fresher lineup than AMD here, with only the GM106 being the totally new sku here (a move AMD makes quite frequently, with their 4770, their 7790 and their 285).
And then GM204 came in and left AMD entire lineup feeling dated. By itself GM204 isnt an impressive launch performance wise, but because the PR strategy that now favors perf-watt instead of absolute perf at the top end, and the shafting to the Kepler SKUs driver-wise, GM204 indeed looked great.
I think 3 mistakes are biting AMD hard here:
- Their uarch progression strategy just after Llano was not only taken from their CPU division, but also extremely affected by the APU release schedule. This made AMD's GPU division be dragged down by CPU's division philosophies regarding uarch progression and release schedules (remember the famous slide saying " yearly APU releases with the latest gpu tech for every new APU's igp release"?) and influenced this new GCN 1.x type of uarch progression (instead of big uarch changes in a 2-year cadence) ,to a new position where one can argue if the roles have reversed (CPU division following GPU's 2 yearly cadence) but in reality this is both the CPU space has stalled and the budget AMD has for R&D has diminished quite abruptly.
- Bad sales predictions left AMD with a HUGE inventory issue regarding Hawaii/Tahiti (and probably pitcarin too).
- Probably not predicting the process progression stall (28nm for what, 4 years now?) and sticking to their design philosphy of "each big uarch change comes with a new process node" when their big uarch change should have happened midway 28nm, not in a few months when 28nm finally seems to be on its way out.
Both 3 left AMD where it is today: dragged to release uarch updates in tiny bits, not only because that is what the APU schedule mandates, but also because their R&D today wont allow them to do a full GCN 1.1 lineup for 200 series, and a full 1.2/1.3 lineup for the 300 series. Today their release schedule fits a bigger company better (a company capable of designing 4 die variations of a same GCN updated generation each year). Sadly this isnt the case for AMD now. Designing new dies involves tons of money, so probably what would be best for AMD right now would be stick to NV's strategy of making big uarch changes ever y 2 or 3 years, tweak via drivers/bios the rebranded skus that will fill the holes in that bigger cadence, and make greater leaps in every metric.
AMD started to show its lesser R&D budget the moment they released such a crammed design as Hawaii. The worse thermals paid as trade off, added with the god awful reference design left them with a tainted image that still cant be reverted to this day (for how long have we seen users recommend 290/x Tri-X but still get dismissed because everyone can only remember, conviniently for NV's PR force, the loud and hot reference cooler?)
The 7000 series was mostly GCN 1.0 with just 1 GCN 1.1 SKU (7790). Competition from AMD in the dGPU space was good at that time, even with NV going full offense with their PR force exploiting the crossfire smoothness issues.
In the other hand, the 200 was only comprised of 2 new die configurations, one GCN 1.1 (Hawaii) and one GCN 1.2 (285), while the rest of the lineup was still rebrands of 7000 series. Here is when NV started this big swing in marketshare, filling more gaps with cut down dies than AMD (NV had 3 SKU variations per die at the top end than AMD which only sports 2 historically). NV didnt actually had a fresher lineup than AMD here, with only the GM106 being the totally new sku here (a move AMD makes quite frequently, with their 4770, their 7790 and their 285).
And then GM204 came in and left AMD entire lineup feeling dated. By itself GM204 isnt an impressive launch performance wise, but because the PR strategy that now favors perf-watt instead of absolute perf at the top end, and the shafting to the Kepler SKUs driver-wise, GM204 indeed looked great.
I think 3 mistakes are biting AMD hard here:
- Their uarch progression strategy just after Llano was not only taken from their CPU division, but also extremely affected by the APU release schedule. This made AMD's GPU division be dragged down by CPU's division philosophies regarding uarch progression and release schedules (remember the famous slide saying " yearly APU releases with the latest gpu tech for every new APU's igp release"?) and influenced this new GCN 1.x type of uarch progression (instead of big uarch changes in a 2-year cadence) ,to a new position where one can argue if the roles have reversed (CPU division following GPU's 2 yearly cadence) but in reality this is both the CPU space has stalled and the budget AMD has for R&D has diminished quite abruptly.
- Bad sales predictions left AMD with a HUGE inventory issue regarding Hawaii/Tahiti (and probably pitcarin too).
- Probably not predicting the process progression stall (28nm for what, 4 years now?) and sticking to their design philosphy of "each big uarch change comes with a new process node" when their big uarch change should have happened midway 28nm, not in a few months when 28nm finally seems to be on its way out.
Both 3 left AMD where it is today: dragged to release uarch updates in tiny bits, not only because that is what the APU schedule mandates, but also because their R&D today wont allow them to do a full GCN 1.1 lineup for 200 series, and a full 1.2/1.3 lineup for the 300 series. Today their release schedule fits a bigger company better (a company capable of designing 4 die variations of a same GCN updated generation each year). Sadly this isnt the case for AMD now. Designing new dies involves tons of money, so probably what would be best for AMD right now would be stick to NV's strategy of making big uarch changes ever y 2 or 3 years, tweak via drivers/bios the rebranded skus that will fill the holes in that bigger cadence, and make greater leaps in every metric.
AMD started to show its lesser R&D budget the moment they released such a crammed design as Hawaii. The worse thermals paid as trade off, added with the god awful reference design left them with a tainted image that still cant be reverted to this day (for how long have we seen users recommend 290/x Tri-X but still get dismissed because everyone can only remember, conviniently for NV's PR force, the loud and hot reference cooler?)
