Forgive me Mike.
You have the commercial "shim" that is currently being marketed in mind and I did not mean that and never have seen one, but I intended the term as I have heard it used over the years in other applications. I apologize for the confusion. I simply meant a copper "plate" that sets entirely on the portion of the cpu that normally is in contact with the heat sink. That is, as you say, on the source of the heat that is conveyed to the sink. The function of this plate (or "shim," as I used it) bonded to the cpu face is to provide a more reliable and efficient conduit for the heat because of the bonding process, ... at least that was Step's claim. There need not be any additional conduction of heat "back" to the portion of the cpu board surrounding the raised chip surface. Ideally it should contact the cpu on its bonded face and the heat sink on its other face, and nothing else.
If the claim that the bonding process IS a more efficient conductor of heat to the copper plate (shim), then there is no reason why this would not reduce heat in the cpu more effectively, and no reason for it to return heat to the cpu board. (I will note, however, that Step did have a small amount of stabilizing material between the cpu board and the plate some distance away from the cpu, but it could have been a non conducting material, for all I know, or not even essential.)
I think it is just a question of whether or not the "bonding" process transfers heat more efficiently or not. I would think that the fact that others bond copper to aluminum suggests that they think this a better process for some reason.
anvil