Ivy Bridge and Haswell die configurations(estimates included)

[IntelUser2000]

(Original picture courtesy of PCWatch)

Ivy Bridge has 4 seperate dies. Red outline is a cut line to achieve smaller configurations. Here's how the full configuration, 4 CPU cores, 8MB L3 cache + GT2 graphics with 16 EUs look like.

Now 2 CPU cores, 4MB L3 + GT2 graphics

4 CPU cores, 6MB L3 + GT1 graphics(You'll see why it ends up with 6 EUs rather than 8)

2 CPU cores, 3MB L3 + GT1 graphics(Again, 6 EUs)

How would Haswell look like? Green outline is how big Haswell would be.

Haswell, 4 core + GT2

Haswell, 4 core + GT3(My guess)

Die sizes:

Ivy Bridge

4C + GT2 = 160mm2
2C + GT2 = 117mm2
4C + GT1 = 120mm2
2C + GT1 = 87mm2

Haswell

4C + GT2 = 185mm2
4C + GT3 = ~210mm2 assuming System Agent hasn't been expanded. 230mm2 possible

There's very likely more variants for Haswell. But I just included two.

 

[Idontcare]

On Sandy Bridge the GPU is an effective dark silicon area, but the asymmetry in the layout of dark silicon (the GPU) plays a role in the effectiveness of the cooling effect on the cores.

Ivy Bridge is equally asymmetric, and the unintended dark silicon effects for it will likely mirror that seen in Sandy Bridge.

But the early reports on IB's operating temps is that they do have a temperature issue, and would be better served with a more judicious layout of GPU and Agent System areas.

In this regard, while doing so would certainly add complexity to the overall chip design and integration, there is an opportunity here for Intel to better leverage the synergy of dark(er) silicon intermixed with the hotter silicon areas of the cores when it comes to Haswell.

Perhaps the GPU area, and maybe the other currently compartmentalized and partitioned sections of the die, will be more scattered around in layout to better homogenize the overall cooling effects provided by the dark(er) silicon?

 

[Khato]

In this regard, while doing so would certainly add complexity to the overall chip design and integration, there is an opportunity here for Intel to better leverage the synergy of dark(er) silicon intermixed with the hotter silicon areas of the cores when it comes to Haswell.

Perhaps the GPU area, and maybe the other currently compartmentalized and partitioned sections of the die, will be more scattered around in layout to better homogenize the overall cooling effects provided by the dark(er) silicon?

While I wouldn't advise expecting a scattered layout to make better use of the 'darker silicon', the implied HSW GT3 die configuration does introduce a possible improvement in that regard as each core would have one edge bordering graphics. Heh, it'd actually give a reason for the unlocked overclocking SKUs having the GT3 die.

 

[Jman13]

Hmmm...my coolest to hottest cores are inverted from yours...I'm sure it's just logical assignment, (my core 0 is your core 3, my core 1 is your core 2, etc...) My core 1 is hottest, core 2 next, core 0 next, and core 3 is coolest.

 

[grimpr]

On Sandy Bridge the GPU is an effective dark silicon area, but the asymmetry in the layout of dark silicon (the GPU) plays a role in the effectiveness of the cooling effect on the cores.

Ivy Bridge is equally asymmetric, and the unintended dark silicon effects for it will likely mirror that seen in Sandy Bridge.

But the early reports on IB's operating temps is that they do have a temperature issue, and would be better served with a more judicious layout of GPU and Agent System areas.

In this regard, while doing so would certainly add complexity to the overall chip design and integration, there is an opportunity here for Intel to better leverage the synergy of dark(er) silicon intermixed with the hotter silicon areas of the cores when it comes to Haswell.

Perhaps the GPU area, and maybe the other currently compartmentalized and partitioned sections of the die, will be more scattered around in layout to better homogenize the overall cooling effects provided by the dark(er) silicon?

Interesting ideas as usual IDC, this reminds me of AMD's technique of cpu/gpu core shared cooling in Llano, page 27.

http://hotchips.org/uploads/hc23/HC23.19.9-Desktop-CPUs/HC23.19.930-Llano-Fusion-Foley-AMD.pdf

 

[IntelUser2000]

Perhaps the GPU area, and maybe the other currently compartmentalized and partitioned sections of the die, will be more scattered around in layout to better homogenize the overall cooling effects provided by the dark(er) silicon?

I'm not sure if they will priotize arranging the die for thermals over modularity. You can see both Ivy Bridge and Sandy Bridge is designed with cut lines for modularity from the start. I also think its a little early to judge thermals. I can't rule it out, but I will reserve judgment until I see tests on official day.

I also wonder if they are using the GPU area for thermal purposes, how it would be in the future when iGPU performance ramps up significantly in the near future? You know that discrete GPUs aren't the coolest running devices.

 

[Smartazz]

Thanks for the info on dark silicon IDC. I've heard of the effect before but I wasn't sure if it were true or not. I guess the integrated graphics does have some use even if you use a dedicated GPU.

 

[Idontcare]

Interesting ideas as usual IDC, this reminds me of AMD's technique of cpu/gpu core shared cooling in Llano, page 27.

http://hotchips.org/uploads/hc23/HC23.19.9-Desktop-CPUs/HC23.19.930-Llano-Fusion-Foley-AMD.pdf

Awesome link :thumbsup: Had not seen that before, very nice.

And yeah, page 27 is exactly what I was clumsily trying to talk about, I'm not surprised these guys are on top of it (and have been for years) but I am glad to see they are leveraging it for an intentional benefit.

 

[bryanW1995]

Great thread guys.

Haswell cannot get here soon enough.

 

[Obsoleet]

Been waiting quite some time now for Haswell.

I've said screw SB/IB, everything after my Yorkfield since the news broke on all of them.. Haswell is my baby.