hey all,
(I am putting this here since "Heat and Cooling" are the major thrust of this thread but if it should go to one of the others go ahead and move it Mods.)
I just got a new duron 750 after the one I had died. I was running a volcano II with white thermal grease. Temps at default idle speed were 30C and ambient was 17C (this was before the weather warmed up these past few weeks)
When I fried the CPU I noticed a small bit of plastic from the thermistor melted to the back of the ceramic on the CPU? Did this do anything?
Anywho, I lapped the HSF and used ASII with the new processor. I tinted the HSF with the ASII and wiped it off, then I applied a thin coat of ASII to the core and put it all together - this time with a "cool shim" for added protection since a slight chipped to the core helped it overheat. I wondered if the shim had anything to do with it but I checked its fit thouroughly before I put it together for the final time. With the core in contact directly with the heatsink base the shim still slipped inbetween the CPU base and heatsink base, so I know the shim is not too tall and the correct thickness.
Now I have temps at 34C and 21C ambient (PC is in basement office) Is this rise in temps due to ambient rise or did the act of frying my first processor alter how my thermistor may report temps? I realize that these thermistors are not reliable in reporting temps but I was just curious. At first I was a little miffed by having higher temps but several factors have changed. 1. Its warmer, 2. Its a different CPU altogether, and 3. The thermistor may be altered either in position or missing some of its plastic from melting.
All in all I am just curious, as I am rather happy to have a new processor, and I know that the ASII is helping even if my reported temps don't change much. But I do overclock (burning this one in at default for a day or so first) and I don't want this 4C differntial to make life harder for me.
So has anyone seen this before? Any insight would be great. Thanks
(I am putting this here since "Heat and Cooling" are the major thrust of this thread but if it should go to one of the others go ahead and move it Mods.)
I just got a new duron 750 after the one I had died. I was running a volcano II with white thermal grease. Temps at default idle speed were 30C and ambient was 17C (this was before the weather warmed up these past few weeks)
When I fried the CPU I noticed a small bit of plastic from the thermistor melted to the back of the ceramic on the CPU? Did this do anything?
Anywho, I lapped the HSF and used ASII with the new processor. I tinted the HSF with the ASII and wiped it off, then I applied a thin coat of ASII to the core and put it all together - this time with a "cool shim" for added protection since a slight chipped to the core helped it overheat. I wondered if the shim had anything to do with it but I checked its fit thouroughly before I put it together for the final time. With the core in contact directly with the heatsink base the shim still slipped inbetween the CPU base and heatsink base, so I know the shim is not too tall and the correct thickness.
Now I have temps at 34C and 21C ambient (PC is in basement office) Is this rise in temps due to ambient rise or did the act of frying my first processor alter how my thermistor may report temps? I realize that these thermistors are not reliable in reporting temps but I was just curious. At first I was a little miffed by having higher temps but several factors have changed. 1. Its warmer, 2. Its a different CPU altogether, and 3. The thermistor may be altered either in position or missing some of its plastic from melting.
All in all I am just curious, as I am rather happy to have a new processor, and I know that the ASII is helping even if my reported temps don't change much. But I do overclock (burning this one in at default for a day or so first) and I don't want this 4C differntial to make life harder for me.
So has anyone seen this before? Any insight would be great. Thanks
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