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Semicondcutoir Business News
(05/09/03 02:02 p.m. EST)
Rumors are running rampant that IBM Corp.'s Microelectronics Division is reportedly in the process of building a new, advanced fab for Advanced Micro Devices Inc.
Reports have surfaced that IBM is gutting its so-called Advanced Semiconductor Technology Center (ASTC) in East Fishkill, N.Y., and turning it into a full-fledged 300-mm, sub-100-nm fab. Once the fab is equipped, IBM will reportedly turn the plant over to AMD, sources said. In turn, AMD will make next-generation processors in the fab, they added.
IBM declined to comment, saying it does not discuss rumors.
The companies are no strangers to each other. In January, AMD and IBM entered into an agreement to jointly develop chip-making technologies for use in future high-performance products.
The new processes, developed by AMD and IBM, will be aimed at improving microprocessor performance and reducing power consumption, and will be based on advanced structures and materials such as high-speed silicon-on-insulator (SOI) transistors, copper interconnects and improved "low-k dielectric" insulation. The agreement includes collaboration on 65- and 45-nm and 300-mm wafers (see Jan. 8 story ).
http://www.siliconstrategies.com/story/OEG20030509S0034
(05/09/03 02:02 p.m. EST)
Rumors are running rampant that IBM Corp.'s Microelectronics Division is reportedly in the process of building a new, advanced fab for Advanced Micro Devices Inc.
Reports have surfaced that IBM is gutting its so-called Advanced Semiconductor Technology Center (ASTC) in East Fishkill, N.Y., and turning it into a full-fledged 300-mm, sub-100-nm fab. Once the fab is equipped, IBM will reportedly turn the plant over to AMD, sources said. In turn, AMD will make next-generation processors in the fab, they added.
IBM declined to comment, saying it does not discuss rumors.
The companies are no strangers to each other. In January, AMD and IBM entered into an agreement to jointly develop chip-making technologies for use in future high-performance products.
The new processes, developed by AMD and IBM, will be aimed at improving microprocessor performance and reducing power consumption, and will be based on advanced structures and materials such as high-speed silicon-on-insulator (SOI) transistors, copper interconnects and improved "low-k dielectric" insulation. The agreement includes collaboration on 65- and 45-nm and 300-mm wafers (see Jan. 8 story ).
http://www.siliconstrategies.com/story/OEG20030509S0034
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