Normally, I perceive, a die shrink is a win win for the OEM and the consumer. The OEM makes a lot more product for the same resources and the consumer gets better performance. At least that is the way it has always seemed to happen. Now, the flash memory manufacturing process reduction from 34 nm to 25 nm seems to have resulted in slower speeds. OCZ stated "One effect of the die shrink ... the NAND is not as robust as the previous generation ... This made necessary a reduction in the rated P/E cycles.". Does this imply this latest shrink has exceeded theoretical limits and was only done because of the huge savings in the manufacturing process? Are we not likely to see another die shrink iteration unless an entirely new technology is implemented?