Intel's strategy with Goldmont Atom: How far will this extend?

cbn

Lifer
Mar 27, 2009
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From the 2013 Intel Investor Meeting:

http://intelstudios.edgesuite.net/im/2013/archive/bk/archive.html

We are gonna be more pragmatic, to drive these solution into the market quicker. (..) Think of it as the next-generation Atom. What's different about this, and what we've done to accelerate this, is that this is a core that has a complete new what we call chassis, or basically connectivity that allows to do iterations and derivatives of this core at a very fast clip. Think of it as a core with a common chassis that allows connection of IP both internal and external IP at a very fast rate. The kind of rates that you'd see with external products. The kind of rate our competitors do, this capability. And you've said: why can't Intel. And this product is the kind of product that brings that capability really to reality.

I really like how this sounds, but I wonder far will this strategy extend and how Intel will implement this?

Are we actually going to see Intel develop a "design foundry approach"? Or will this strategy be implemented in another way?

In any event, I am really excited about the possibilities here and I am hoping this will help relieve concerns I have regarding Intel competing on the low end (particularly the extreme low end).
 

Revolution 11

Senior member
Jun 2, 2011
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Talk is cheap, I have found, and there are a number of barriers before this plan can work. Though I wish for the best, Atom has been neglected until recently and Intel has a lot of ground to catch up on.
 

cbn

Lifer
Mar 27, 2009
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The more I think about this...... If Intel eventuallty starts fabbing third party ARM SOC designs or possibly even smartphone "combo chips" such a chassis on Goldmont atom could allow Intel to quickly design and ship more integrated phone SOCs.

So maybe having this "cpu chassis" capability is going to help Intel as they wait for external IP to arrive at their foundry (from other ARM based SOC customers)? Or, in some cases, Intel planning to more aggressively bring external IP to their foundry? Maybe a combination of both?

For example, Instead of having SoFIA + combo chip there would be single combined phone SOC (with the CPU, GPU, modem and all the combo chip IP integrated). Or maybe specialized phone SOCs with limited baseband (at the smallest possible die size) for emerging markets?

With that mentioned, I am not much of a mobile phone guy.....so maybe this information is off by quite a bit (someone please correct me if I am wrong).
 

Nothingness

Diamond Member
Jul 3, 2013
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is this HSA?
Not at all, it's called (on-chip) interconnect. It's a standardized bus that allows compatible IP to deal with each other.

SoC vendors have been doing that for many years (AMBA, OCP, etc.), Intel is only catching up. I hope they chose an existing standard.
 

NTMBK

Lifer
Nov 14, 2011
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Perhaps they have licensed the AMBA bus from ARM? That would make integrating 3rd party IP much easier, if they want to chase semicustom contracts.
 

cbn

Lifer
Mar 27, 2009
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A really interesting article on reducing BOM with Windows 8.1 with bing:

http://www.anandtech.com/show/8048/windows-81-with-bing

According to the article, this will apply to all devices with 9" screen and smaller. Minimun specs have also been reduced to 1GB RAM and 16GB eMMC or SSD.

Free OS, inexpensive RAM and inexpensive eMMC costs should go a long way to making the total price of a Small Windows Tablet or phone affordable. So now it will be very interesting to see how low end and integrated Intel could potentially go on the processor (to help match those other low costs).

I am excited to see where this could go, but only hope Intel can really execute on the low end where the situation can get very competitive.
 

cbn

Lifer
Mar 27, 2009
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Regarding integration on the low end, I was happy to find out Intel is making their own "combo chip":

http://www.fool.com/investing/gener...ghtning-peak-is-the-missing-puzzle-piece.aspx

If you listen to any of the presentation materials from any of the major chip vendors to the high-volume mainstream smartphone space, the key message from these vendors is that OEMs want the whole platform. Up until very recently, Intel (NASDAQ: INTC ) has been missing a pretty critical piece of that platform -- a low-power connectivity solution (Wi-Fi, Bluetooth, and so on). Intel has long sold connectivity products for notebooks and desktops, but for its mobile platforms it has relied on external chips from the likes of Broadcom (NASDAQ: BRCM ) and Qualcomm (NASDAQ: QCOM) .

However, the less sexy (but equally interesting) part of this article was that Intel had demonstrated its very first low-power Wi-Fi/Bluetooth combination chip intended for smartphones and tablets. This completes the final part of Intel's low-power puzzle and allows the company to offer a complete mobile platform solution using Intel-designed silicon. This not only makes life easier for the OEMs (as they have one supplier for the major components), but it also allows Intel to capture more content share in handsets/tablets.

Intel now joins Broadcom, Qualcomm, and others
Smartphone processor winners such as Qualcomm, MediaTek, and Marvell (NASDAQ: MRVL ) have had the entire platform for quite some time. Broadcom has had it too, although its modem development as well as its applications processors have traditionally been weak relative to that from the competition. Intel, on the other hand, recently sorted out its modem and the applications processor (but still needs to integrate them together), but it has sourced connectivity products from third parties.

For very high-end phones, this isn't much of a problem -- the handset OEMs like to pick and choose each component in that case, and Broadcom seems to win the very high-end sockets. However, for more mass-market designs, OEMs don't want to worry about that and instead want a complete platform with drivers delivered so that they can get to market quickly. Without the full platform, gaining meaningful design win traction is, as Intel has seen, very difficult.

Intel now has the complete platform and, over the course of 2015 and 2016, should release products known as SoFIA that more tightly integrate the cellular modem, connectivity combo, and the apps processor for even more cost savings for entry-level and value handsets.

So that is good news to me.

The next step would be the integration of Applications processor, modem and connectivity into a single piece of silicon.....but I wonder when that will happen, what process tech will be used and what the final configuration will be?
 

Homeles

Platinum Member
Dec 9, 2011
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The next step would be the integration of Applications processor, modem and connectivity into a single piece of silicon.....but I wonder when that will happen, what process tech will be used and what the final configuration will be?
Probably 14nm with Broxton. It's just taking time to port everything over from TSMC. Might be the generation after ("tick" @ 10nm) at latest.
 
Mar 10, 2006
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Probably 14nm with Broxton. It's just taking time to port everything over from TSMC. Might be the generation after ("tick" @ 10nm) at latest.

Intel is launching SoFIA on 14nm in Q1 2016 which will be a 14nm part with connectivity + LTE-Advanced integrated on a single piece of silicon.
 

erunion

Senior member
Jan 20, 2013
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Intel is launching SoFIA on 14nm in Q1 2016 which will be a 14nm part with connectivity + LTE-Advanced integrated on a single piece of silicon.

Seriously? That's a brutal slip.

421904-intel-mobile-roadmap-mwc-2014.jpg
 

cbn

Lifer
Mar 27, 2009
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Intel enters a strategic agreement with Rockchip:

http://www.anandtech.com/show/8061/...gic-agreement-with-chinese-soc-maker-rockchip

This is Huge: Intel Enters Strategic Agreement with Chinese SoC Maker Rockchip

Intel's march into the ultra mobile space has been a frustrating one. Architecturally Intel has the chops to play in the market, but its execution has been met with challenges. At first Intel seemed to bet too heavily on non-Android OSes (primarily Windows tablets) and now its challenge seems to be more an issue of getting its designs into the market quickly and ultimately used by OEMs. The Android tablet space in particular is in a race to the bottom, leaving little room for another premium SoC vendor outside of Qualcomm. Intel recently announced a new family of lower cost, entry-level Bay Trail SoCs to help adjust to the changing market, but today it announced an even more aggressive play: a strategic partnership with Rockchip.

Rockchip is one of a handful of fabless semiconductor manufacturers based in China, presently specializing in the development of ARM based mobile SoCs. Under today's announcement however, Intel will be leveraging Rockchip to bring a low cost (entry/value) Intel branded SoC platform for tablets (read: sub-$150 Android tablets with connectivity).

Intel first started talking to Rockchip about this agreement a "couple quarters" ago. There are two primary motivations behind the agreement: it gives Intel additional resources to bring products to the market, and it allows Intel to scale IA based Android tablets pretty quickly.

By the middle of 2015 Intel and Rockchip will launch a new SoFIA SoC, featuring four Intel Atom cores and an Intel 3G modem. From the text of the announcement, it sounds like Intel will be providing the IP for the SoC while Rockchip will handle the integration of the design itself:

“We are always looking for innovative ways to differentiate our product portfolio, and the first-of-its-kind collaboration with Intel helps us do this,” said Min Li, Rockchip CEO. “The combination of Intel’s leading architecture and modem technology with our leading mobile design capability brings greater choice to the growing global market for mobile devices in the entry and value segments.”

The original SoFIA roadmap had a dual-core part with integrated 3G shipping in late 2014 as well as a quad-core with LTE by the middle of 2015. For the China market, a dual-core value SoC wasn't going to fly so Intel needed to fill the hole in its roadmap with a quad-core 3G solution. A quad-core 3G part would be offered at a lower price point than the quad-core LTE option, leaving a hole in Intel's roadmap in a very price sensitive market. By partnering with Rockchip, Intel leverages some of Rockchip's design teams to bring the part to market without Intel incurring additional burden for what I can only assume will be a fairly low margin SoC. Rockchip was in around 40 million tablets last year, so this gives Intel access to a reasonable TAM as well.

In return, Rockchip becomes the first company to be able to more or less license Intel x86 CPU IP for use in this combined, Intel-branded SoC. The low-cost ARM based SoC market is crowded and it's tough to differentiate when all of your competitors have access to the same ARM CPU IP. In this case, Rockchip gets access to Silvermont which it may be able to use to set itself apart from the competition. There's obviously a tradeoff in shipping x86 into the Android space, but if Rockchip can help Intel get its numbers up the x86 problem could reduce over time.

Although the SoC would use the Intel brand there may be some reference to Rockchip, perhaps in the model number.

Intel wouldn't go into specifics on how the arrangement works, other than to say that Intel would work with Rockchip to do the SoC integration and Rockchip will bring its own IP to the table as well. Intel gave the example of Rockchip bringing 3rd party graphics IP to the SoC. Rockchip's existing products use ARM and Vivante GPU cores, so we may end up seeing an SoC that uses Intel x86 cores with Mali graphics.

If I'm reading this correctly it marks a big shift in Intel's approach to the mobile SoC market (and chip making in general). Intel claims the resulting SoC will be very price competitive. Leveraging Rockchip for integration likely means a substantially lower cost structure than traditional Intel SoCs. The design will continue to be fabbed at TSMC.

Each company will focus on selling the Intel-branded part to its own customers. Intel isn't disclosing how the profit sharing/revenue reporting will work. The agreement doesn't prevent Rockchip from continuing to sell ARM based SoCs and there's no financial investment from Intel in Rockchip.

Although there's only one product being talked about today (this quad-core Silvermont with integrated 3G), Intel stressed that the deal is strategic - implying that we should see more engagement over time. If this initial quad-core design works well, I can see Intel shifting more of its mobile SoC design integration over to Rockchip. More than anything this is a sign that Intel is willing to try something new/different, and that's absolutely what the company needs.

So Rockchip's SoFIA for 2015 will be a quad core + 3G. This, in contrast, to Intel's SoFIA for 2015 which will be quad core + LTE.

As far as the rest of the Intel and Rockchip agreement goes, it will be interesting (to say the least!) to see how this works out. I am optimistic though. Certainly it has the potential to put some very inexpensive x86 Windows and Android based tablets and phones in the hands of consumers.

P.S. One thing I know about Rockchip, is that they are the predominant SOC used in the various HDMI sticks. I wonder if we will see an x86 SOC used in that capacity?
 
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