Intel's next-gen Skylake-E processor will arrive in LGA 3647 socket

csbin

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Feb 4, 2013
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http://www.tweaktown.com/news/52336...e-processor-arrive-lga-3647-socket/index.html

Computex 2016 - During our first day at Computex, we've spotted some seriously cool hardware, but one of our world exclusives is that Intel will be releasing their next-gen Skylake-E processors onto a new motherboard, with more pins than ever before.

Right now the HEDT processors slot into an LGA 2011 motherboard, but the next-gen chips will be slotting into LGA 3647 socket. This is an interesting tidbit, as it means there'll be new motherboards next year when Skylake-E launches, with 1636 more pins. The socket itself is absolutely huge, especially when compared to the already large LGA 2011 socket, and positively massive compared to the current LGA 1151 in the mainstream market.


medish.jpg
 
Mar 10, 2006
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I didn't think Intel would actually use LGA-3647 for HEDT. Old leaks pointed to something like an LGA-2011 v4.
 

24601

Golden Member
Jun 10, 2007
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I sure hope this news doesn't mean that Skylake HEDT prices (as well as chipset/mobo prices for it) will skyrocket.
 

csbin

Senior member
Feb 4, 2013
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Lower pin count than on AMD :sneaky:


AMD Opteron SP3 Socket?:D


Noctua Unveils Prototype Large Socket Heatsink for Xeon and Opteron Chips

Noctua unveiled a prototype fin-stack heatsink for very large CPU socket types, such as Intel Socket P (LGA3647) and AMD SP3, powering chips such as Intel Xeon Phi "Knights Landing," and upcoming AMD Opteron SP3 32-core SoCs. There will be 3U and 4U versions of this heatsink, supporting NF-A9 (92 mm) and NF-F12 (120 mm) fans. The heatsink is just a very large aluminium fin-stack, to which heat drawn from the base is fed by seven 8 mm thick nickel-plated copper heat pipes.
 

The Stilt

Golden Member
Dec 5, 2015
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No idea if that's the actual name, but I recon there will be just a single monster socket :sneaky:
 

BigDaveX

Senior member
Jun 12, 2014
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Is that a secondary slot on that cpu?

I'm guessing that's the power connector. Itanium has always kept the bus and grounding pins separate from the power connectors (which were on the side of the chip on PAC418 and PAC611, and on top of it on LGA1248), so maybe we're finally seeing Intel move to this set-up on their Xeon line.
 

exar333

Diamond Member
Feb 7, 2004
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If you're going to buy a 6950X, I recommend buying at launch so you get the most out of it. Getting one of these chips mid-cycle just feels wrong.

No kidding. I wish Intel would just allow overclocking of their Xeons on the consumer chipsets and just call it a day. Just grab a Xeon and OC it to the moon...