From those graphs, looks like HMC is destined for HPC and HBM is more mainstream. Explains why HMC is in Knight's Landing!
HMC is significantly less restrictive in signalling conditions than HBM. HBM is basically a package only technology. HMC can support both low power on package and medium power on board configurations. Another advantage of HMC is a significant reduction in pins vs HBM. For large bandwidth/capacity implementations, HBM can become rather pad limited. Basically, HBM takes 1/4th the number of pads as HBM at the same bandwidth.
To achieve this, HMC is a die stack + logic die based design. This has some benefits and some detriments. The biggest detriment is the additional die in the stack. OTOH, this die gives some great benefits wrt testing, build in self test, etc. But its biggest advantage is in allow a significant reduction in the number of connectors required.
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