- Mar 13, 2006
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An Intel-led team will reveal a tri-gate FinFET-type quantum-well InGaAs MOSFET at the upcoming International Electron Devices Meeting being held Washington D.C. December 5 to 7.
...At IEDM Intel plans to show the way again with a compound semiconductor version that promises faster transistors than silicon. Intel technical executives have in the past tipped InGaAs, possibly embedded on silicon for ease of manufacturing and to carry non-critical circuitry as a way forward for the semiconductor industry. Intel Fellow Paolo Gargini has proposed the integration of an InGaAs quantum-well FET with a high-K dielectric gate stack.
http://www.eetimes.com/electronics-news/4227382/Intel-compound-FinFET-IEDM
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