IIRC, Broadwell made it to F, and if you go back far enough, there might be some higher numbers from when additional steppings were faster/cheaper. But in terms of money and time spent, SPR quite possibly holds the record.Is this the most steppings of one CPU in the history of mankind?
BTW how much does each new stepping cost? I believe the changes may be made just in a few layers of the CPU, so not all the reticles need to be updated?
Did Broadwell make it to F before it even launched?IIRC, Broadwell made it to F, and if you go back far enough, there might be some higher numbers from when additional steppings were faster/cheaper. But in terms of money and time spent, SPR quite possibly holds the record.
Maybe? I found this article, but it seems a little unclear about what actually happened with the E-step.Did Broadwell make it to F before it even launched?
Ohhhh you meant the client parts! Okay I can see that. Broadwell never made it to desktop (except for the -C parts) and took awhile to make it to mobile.Maybe? I found this article, but it seems a little unclear about what actually happened with the E-step.
If a mask is too coarse to create a layer multiple masks are used per layer indeed. That's what's called double or quad pattering (two and four masks respectively). The simplification of going from DUV to EUV is exactly by reducing the amount of masks by no longer using that multiple pattering for printing finer details. Wikipedia goes pretty deep into this topic for a change.I believe that one layer of the CPU may require few differents masks.
What "lead" are you referring too?
Perhaps you don't realize it (or perhaps you do) but cherry-picking data sets and coming to an absurd conclusion supported by selective memory loss only makes you look like a joke poster to anyone who isn't a brand evangelist.
According to Dr. Ian Cutress Intel is past F.. And its currently on G0 and not ready to Ramp UpDid Broadwell make it to F before it even launched?
I could certainly believe 14 steppings, but that ordering seems odd. It appears that they're shipping on E5, maybe E6? So why would they then do two more full steppings so soon after? Usually companies do post-launch steppings to improve yields or bin split, but then why two? I almost wonder if there's some confusion about counting. Intel often separates the stepping letters for different dies (e.g. A0 for the first die, P0 or something for the second), but if one runs far enough over, they could be forced to skip or do something else weird. Or maybe the G0 is the smaller die that's rumored? Will certainly be interesting to see what actually makes it to market.According to Dr. Ian Cutress Intel is past F.. And its currently on G0 and not ready to Ramp Up
View attachment 67776
A I am with Igor and Locuza here.
A0, A1, B0, C0, C1, C2, D0, E0, E2, E3,E4,E5. It would seem that they did not stay too much on F, so let say F0 was the only F stepping then Jumped to G0 if that is the case then Intel has gone to at least 14 Steppings on Sapphire Rapids.
Sure, there is RTL and gate level simulation available for design verification. However the coverage on system level typically is very low for various reasons - one is simulation speed (10^6 times slower than real-time or even less).I dont know much about CPU development, but I thought that there are some simulation tools available to avoid redoing the silicone again and again.
The problem seems to be that such simulation tools for a new manufacturing process are constantly in flux, as new and new data comes in about the various characteristics of the new process.I dont know much about CPU development, but I thought that there are some simulation tools available to avoid redoing the silicone again and again.
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