I have installed heatsinks on multiple AMD64 processors, multiple times. This is basically the procedure I now use for AMD64, and it should work fine on C2D (both have integrated heat spreaders, or IHS's, the part where you apply the paste).
1) get either a sandwich baggie or some latex gloves.
2) place enough thermal compound (AS5 is my preferred compound) on the IHS that you estimate will cover the chip with a very thin layer (thin enough that you can still see that there is a stepping on top of your processor). Obviously, that estimate assumes you haven't lapped your chips IHS....if your lapping IHS's you probably don't need these instructions anyway.
3) using your gloved finger or your finger in a sandwich baggie, spread the compound evenly across the chip. An old/free credit card helps here.
4) smear the SMALL excess amount of compound on your finger on the bottom of the heatsink.
5) remove excess compound from the edges of the IHS CAREFULLY, using a lint-free cloth preferably (since no one has those lying around, a paper towel or napkin will do), and some rubbing alcohol (again, ideally 100% alcohol, but realistically any % alcohol will do, as long as its not the cold beer in your other hand).
6) Mount the Heatsink. This method eliminates the drop and twist to spread method commonly suggested (by AS5 until recently). That is virtually impossible to do with modern heatsinks and tower designs.
Enjoy a cold processor and fast speeds!
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