• We’re currently investigating an issue related to the forum theme and styling that is impacting page layout and visual formatting. The problem has been identified, and we are actively working on a resolution. There is no impact to user data or functionality, this is strictly a front-end display issue. We’ll post an update once the fix has been deployed. Thanks for your patience while we get this sorted.

IC Packaging

G

gnomepunk

Senior member
I need some info on IC packaging specifically advantages and disadvantages in terms of cost, manufacturability, mounting requirements, PC board area, ease of handling, robustness of the packaging, etc.

I have a few application notes and papers, but everything just seems to describe the general difference of DIP, PGA, TSOP, BGA, etc.

Thanks!
 
Well, I'm no expert in this area, but my understanding is that most IC's are packaged in either blister packs, or "cling" wrap (for lack of a better word). I do know that virtually all (at least nowadfays) of these packages are plastics that have been either coated with a thin conductive film or impregnated with a conductive substance (carbon black or metal particles). Thin films are geerally more expensive to produce then impregnated polymers, but they can achieve a higher overall conductivity (well, this depends on the thickness of the film and its uniformity, but in most cases its true). You want to wrap an IC in stuff like this to protect against charge buildup that can damage the IC. Thus, higher conductivity = greater protection = greater cost.

 
I don't think and of the advantages/disadvantages ýou list come on top of the list (maybe with the excpetion of cost). Signal intergrity, packing density and number of connectors are probably far more important.
E.g. standard hole-mounted DIP is cheap and rather robust but doesn't work well for high speeds (due to the reactance of the long leads), the pins are far apart (again a problem at high speeds and when using IC which need a lot of connections to the outside world) and the ICs themselves are rather large.

I think that is about as simple as you can make it, any real explanation will include the technical stuff.
 
Ah! I misunderstood your question. I thought you were looking for info on the type of packaging IC stuff is shipped/stored in. My bad....
 
You must log in or register to reply here.

TRENDING THREADS

Back
Top