Also, what would happen if you stuck the chip in a vise and tightened it? (So as to reduce the gap between IHS and die...)
What about special "Haswell optimized" heatsink bases, that are slightly convex so as to push the IHS into the die?
If chip that was going to be delid was warmed up to 150f would the extra heat help to soften up intels black glue paste.
I've been thinking about this too. The CPU can take up too 100C (212F) so there should be no danger...
