How to tell if I have a PPGA or a FCPGA processor?

[SLPFirehawk]

I have a bad motherboard. So I'm looking at getting another one to replace it. I do not want to change out the processor however. I have a Celeron 400...and am wanting to purchase the Asus CUSL2-C mainboard. The Asus board does not accept PPGA processors...How do I tell if I have a PPGA or FCPGA processor??

 

[PliotronX]

PPGA chips' die are about the size of a quarter (.25u fab), FC-PGA chips' die are about the size of a penny (.18u fab).

Not sure about the PPGA and CUSL2 tho =\

 

[Napalm]

PPGA cores are metal, FCPGA cores are ceramic.

Napalm

 

[nightowl]

If you are asking about your Celeron 400, it is a PPGA cpu. The first FCPGA Celerons was the 533A and faster CPUs and all Socket 370 P3s are FCPGA as well. If you are looking for a board for your Celeron 400, I believe almost all Socket 370 boards with the BX chipset will accept PPGA cpus.

 

[Wingznut]

The Celeron 400 is a PPGA cpu.

(EDIT: Damn, JUST beat me to it. )

 

[TimeKeeper]

this is easier!

You see GREEN cpu = FCPGA
You see Black cpu =PPGA

 

[Wingznut]

Besides, the Asus CUSL2 does support PPGA Celerons. The CUSL2-C however, does not.

Asus motherboard site

 

[SLPFirehawk]

Thanks everyone!

 

[erm]

Guys.
May I know the full terms for the FGA or something?
I m interested to learn .
Thanks.

 

[toph99]

erm:
PPGA = Plastic Pin Grid Array(i believe)
FCPGA = Flip Chip Pin Grid Array

 

[TimeKeeper]

The FC-PGA = Flip Chip Pin Grid Array
The PPGA = Plastic Pin Grid Array

someone got faster finger..haha..



<< The PPGA package used on the Intel® Celeron? processors has the actual silicon core facing down towards the motherboard. The silicon core is covered by a heat slug helping to dissipate heat from the core. The heat slug transfers heat from the core to the heatsink. As processors get smaller and faster, the ability to dissipate heat from the processor core is become more and more critical. The FC-PGA package, flips the silicon core over facing up. The core sits on top of the actual package and is exposed. The silicon die is exposed and makes direct contact with the heatsink >>