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Now that the graphics portion of the die is requiring even more real estate I'm wondering how many different dies we will see for Haswell?
Assuming there are dual and quad core parts I would think that each would be a separate die as it wouldn't make sense to disable two cores and wastes all of that silicon for the dual parts right?
GT1/GT2 are essentially the same so it seems reasonable that there would be
dual core GT1/GT2
quad GT1/GT2
But then there is also GT3. If the graphics portion of the die is really large then it might not make sense for Intel to simply disable half of the EU's to make GT1/GT2 parts so there could be another die for GT3 parts. Of course GT3e is just a matter of adding the separate 128MB edram.
So now we could have
dual core GT1/GT2
dual core GT3/GT3e
quad core GT1/GT2
quad core GT3/GT3e (since we know these will be the high end mobile parts)
What do you think?
Assuming there are dual and quad core parts I would think that each would be a separate die as it wouldn't make sense to disable two cores and wastes all of that silicon for the dual parts right?
GT1/GT2 are essentially the same so it seems reasonable that there would be
dual core GT1/GT2
quad GT1/GT2
But then there is also GT3. If the graphics portion of the die is really large then it might not make sense for Intel to simply disable half of the EU's to make GT1/GT2 parts so there could be another die for GT3 parts. Of course GT3e is just a matter of adding the separate 128MB edram.
So now we could have
dual core GT1/GT2
dual core GT3/GT3e
quad core GT1/GT2
quad core GT3/GT3e (since we know these will be the high end mobile parts)
What do you think?
