i have seen people mention that the new t-breds have not gained much in terms of "cooling aptitude" being that the core is smaller than that of a palmino making a smaller contact area.
also people critisize AMD for not putting on a heatplate to "enlarge" the surface area.
im wondering about makeing one..
my idea is a standard Cu CPU shim and some arctic alumina epoxy. use a little bit of high temp standard epoxy and "paint" the packaging of the CPU(after unlocking it of coarse )
the "glue" the Cu shim into place do a little cleanup and let in cure. next liberally apply AC Alumina making sure to get into all remaining air spaces and then apply a 1mm or 2mm Cu plate and let that cure under some pressure to force the Alumina into cracks better and get a tighter fit in the end.
i think this would give a nice heatplate to the t-breds and also solve the problem of chipped cores....
any other opinions??
also people critisize AMD for not putting on a heatplate to "enlarge" the surface area.
im wondering about makeing one..
my idea is a standard Cu CPU shim and some arctic alumina epoxy. use a little bit of high temp standard epoxy and "paint" the packaging of the CPU(after unlocking it of coarse )
the "glue" the Cu shim into place do a little cleanup and let in cure. next liberally apply AC Alumina making sure to get into all remaining air spaces and then apply a 1mm or 2mm Cu plate and let that cure under some pressure to force the Alumina into cracks better and get a tighter fit in the end.
i think this would give a nice heatplate to the t-breds and also solve the problem of chipped cores....
any other opinions??