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Hey Wingznut what's the scoop on this Intel BBUL thing?

J

JellyBaby

Diamond Member
ZDNet has an article explaining how the processor packing itself is a cpu bottleneck. Intel apparently has a BBUL (pronoucned "bubble"?) aka Build-Up Layer lithography technique that etches the cpu on the same "layer" as the chip's circuits. Pretty cool. And speaking of cool(ing), that means new, matching heat sinks must cover the entire processor surface, correct?
 
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