As it appears, Samsung plans to skip the first-generation HBM memory and will only manufacture products compliant with the second-generation HBM specification, which offers higher densities and clock-rates. Such approach will let Samsung to address broader market segments with its HBM offerings. Right now HBM can only be used on consumer graphics cards and certain highly-custom products, but HBM2 will enable professional and high-performance computing GPU-based solutions, which require a lot of memory onboard.
Samsung is currently working on multiple HBM packages featuring two (2Hi stack), four (4Hi) and eight (8Hi) 8Gb memory devices on a base logic die with 1024-bit interface, according to a slide that the company demonstrated at the IDF (which was published by ComputerBase.de). Maximum data-rates of Samsungs HBM products will be 2Gb/s, which will support up to 256GB/s of bandwidth per chip.
Samsung expects HBM memory to be used for consumer graphics cards and high-performance computing accelerators based on AMD Arctic Islands and Nvidia Pascal graphics processors next year. Sometimes in 2017, network products will also take advantage of the new memory type. Three years from now other applications could employ HBM, according to Samsung.
The worlds largest maker of dynamic random access memory (DRAM) did not unveil any details about its actual HBM chips (capacities, clock-rates, etc.), but expect a family of products with different densities and frequencies.
Samsung did not disclose which process technology it will use to manufacture HBM.
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