- Oct 17, 1999
- 8,883
- 107
- 106
So in servers class we were picking apart rackmount servers and I was surprised to find heatblankets... I mean heatspreaders on the memory modules. I wish these things would go away. Number one the chipset controller for the registration is a different height than the memory chips themselves and B (intentionally changed to lettering scheme for hilarity) spreaders restrict airflow which memory needs a lot more of than a piece of aluminum. I always take spreaders off and place a quiet fan on them and it has always resulted in better overclocking and longer lifetimes. In such a constricted space I would think airflow would be paramount. Sorry for the rant.
Added bonus, I had pulled the heatsink from one of the CPU's on my 1U and there wasn't a syringe of thermal grease in the lab. So I had swabbed it with alkeehawl and left a note on my networking professor's nice new 1U server that due to a mishap there was no thermal interface material on CPU2. I redeemed myself this evening in networking class by laying a nice application of ceramique ii on that bad boy. I told him that I would bet him that CPU would run about three degrees cooler than the other. Now I'm super curious and wanna fire it up.
Added bonus, I had pulled the heatsink from one of the CPU's on my 1U and there wasn't a syringe of thermal grease in the lab. So I had swabbed it with alkeehawl and left a note on my networking professor's nice new 1U server that due to a mishap there was no thermal interface material on CPU2. I redeemed myself this evening in networking class by laying a nice application of ceramique ii on that bad boy. I told him that I would bet him that CPU would run about three degrees cooler than the other. Now I'm super curious and wanna fire it up.