Originally posted by: NeoPTLD
The heat density (W/cm^2) is so high on CPUs and such that silver based pastes are being used. As you can see, surface modification makes all the difference in the way they work. Arctic Silver and conductive paint are both very high in silver content, yet one is nearly an insulator while the other is a very good conductor.
You just proved my point. These legacy devices are not even pushing the limit of thermal resistance. Computer CPUs have a high heat density and a requirement to hold a LOWER temperature than older equipment. This demands a low thermal resistance path from the chip to the air.
What does arctic silver have to do with it ? Are they the ones spouting the gibberish that people should 'update' the paste on their cpu every so often. Hmmm increased sales ? Companies like Arctic Silver became popular mainly because of hype, they created a demand for a product that wasn't really needed. Do you see anyone like Intel buying their stuff in bulk ? You will not because it is not needed. Arctic Silver pitched that unless you used their product , the extra temp of 5C would shorten its life, and it will, it might lose a couple months off the 10 year life span, but who is going to care 10 years from now ? That is what is so annoying about overclockers. They think that because a cpu is above their body temp it is going to fry. Just read the forums with people who are worried because their cpu is 100F, its like some tech version of mass hysteria.
You obviously don't know much about older equipment. There are some transmitters that operate so close to the temperature failing point that if it is too sunny outside the transmitters could fail. If compound was so important and stopped working like you are suggesting they would be changing it on those devices every week.
CPU operate fine with current methods of not replacing the compound, most could even work fine with no compound at all , hotter, but the majority would still operate normally. I worked for Cray and Sandia from 1995-2000 and we never replaced the paste on ASIC that were handling extreme speeds for the time. They ran very hot, one processor we used ran at just 6C from the failure temp. I remember it well because there were 3 ASIC per module so when one failed we would say , 666, satan strikes again . Flouride based coolant was needed to keep the heatsinks operating. The topic of replacing the compound never came up during that time. If it would have made a difference we would have replaced it. It would have been like saying, lets replace the wiring because after 4 years, its all used up.
When the paste dries out and compound turns to dust, it will no longer fill the gap as the device/heatsink changes dimensions with thermal cycles.
If there is proper pressure applied to the heatsink/semiconductor interface the amount of thermal change in transfer is next to none. We will both be dead and gone before thermal compound on a device turns to dust.