"Line yield" is the ratio of how many wafers you put into the fab and how many you get out. If their line yields are 50%, that means they are scrapping/breaking half of the wafers during manufacturing. I'm guessing that the information you got is very inaccurate.
FYI... "Die yield" is the ratio of how many die per wafer function at the minimum speed. Many times it's measured in an ISO standard, which is basically defects per mm^2.