Grantsdale to be recalled

zephyrprime

Diamond Member
Feb 18, 2001
7,512
2
81
Normally, when a chip is being fabricated, an insulating layer of film is deposited to electrically isolate the chip. That film is normally removed from the die pad area, where the chip interfaces with the pins that connect it to the outside world.

In this case, the thin film on a pad area was only partially removed, causing the real-time clock circuitry to be susceptible to excessive leakage
Wow. I'm surprised they made such a simple manufacturing mistake.
 

MDE

Lifer
Jul 17, 2003
13,199
1
81
At least they caught it before millions of chipsets shipped and end users found the problems the hard way.
 

RaiderJ

Diamond Member
Apr 29, 2001
7,582
1
76
Aren't these the same boards with the pins IN the socket, instead of on the CPU? Seems to me like this might be a series of boards to shy away from.
 

Sonic587

Golden Member
May 11, 2004
1,146
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Good thing they caught in in time.

Also, I think it would be a good idea to edit the last part out of the title before this turns into a flame fest.
 

imported_michaelpatrick33

Platinum Member
Jun 19, 2004
2,364
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this stuff happens. I am sure Intel will be fine. I am sure AMD will be fine. There are fixes and no one appears to be to affected so let stand hand in hand and pray to the Computer God Hardwaricus that Her high priests AMD and INTEL peacefully co-exist, innovate decry their greed and gives us lowly mortals great game and pron chips. MMMMMMMM chips
 

Wingznut

Elite Member
Dec 28, 1999
16,968
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Originally posted by: zephyrprime
Normally, when a chip is being fabricated, an insulating layer of film is deposited to electrically isolate the chip. That film is normally removed from the die pad area, where the chip interfaces with the pins that connect it to the outside world.

In this case, the thin film on a pad area was only partially removed, causing the real-time clock circuitry to be susceptible to excessive leakage
Wow. I'm surprised they made such a simple manufacturing mistake.
The article's explanation is very simple... The actual issue wasn't.
 

txxxx

Golden Member
Feb 13, 2003
1,700
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Originally posted by: LTC8K6
Opteron , where quality is no longer to be found.

Nobody is perfect, btw. :D

Indeed. Although a micro-code update can solve the opteron's issue. At least they recalled it, some manufacturers would try to just brush it off.

*cough*IBM 75GXP*cough*
 

SuperTool

Lifer
Jan 25, 2000
14,000
2
0
Originally posted by: Wingznut
Originally posted by: zephyrprime
Normally, when a chip is being fabricated, an insulating layer of film is deposited to electrically isolate the chip. That film is normally removed from the die pad area, where the chip interfaces with the pins that connect it to the outside world.

In this case, the thin film on a pad area was only partially removed, causing the real-time clock circuitry to be susceptible to excessive leakage
Wow. I'm surprised they made such a simple manufacturing mistake.
The article's explanation is very simple... The actual issue wasn't.

So the pad wasn't making good contact with the package, and that caused exessive leakage? I am guessing they weren't getting a full rail signal at the pad.
 

Schadenfroh

Elite Member
Mar 8, 2003
38,416
4
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But But, intel puts so much more time and money into testing and quality assurance than AMD
 

Megatomic

Lifer
Nov 9, 2000
20,127
6
81
Originally posted by: txxxx
Originally posted by: LTC8K6
Opteron , where quality is no longer to be found.

Nobody is perfect, btw. :D

Indeed. Although a micro-code update can solve the opteron's issue. At least they recalled it, some manufacturers would try to just brush it off.

*cough*IBM 75GXP*cough*
That's half the point I was going to make. The other half is that the ICH6x issue can cause data corruption on drives attached to it. I can stomach a crash and reboot, but if I lost the data on my RAID array before I got to back it up I'd be damaged greatly. :(
 

VirtualLarry

No Lifer
Aug 25, 2001
56,587
10,225
126
Originally posted by: zephyrprime
Normally, when a chip is being fabricated, an insulating layer of film is deposited to electrically isolate the chip. That film is normally removed from the die pad area, where the chip interfaces with the pins that connect it to the outside world.

In this case, the thin film on a pad area was only partially removed, causing the real-time clock circuitry to be susceptible to excessive leakage
Wow. I'm surprised they made such a simple manufacturing mistake.

"Real-time clock circuitry"? Hmm.

Do you think that they have an onboard reference clock-generator now?

Maybe the rumors are true, that the 9xx chipsets will have some sort of "anti-overclocking" tech. in them. (Intel does have a patent on a method to block overclocking, based on a second independent clock reference source.)

I thought that all of the threads talking about not being able to overclock the 915 chipset, were based on a mistaken interpretation of the fact that the "performance enhancements" (PAT version 2) of the 925, would be more fully locked-out on the 915, avoiding what we've seen with the i865 with "PAT" matching up to the i875 chipset in terms of performance. (The silicon is actually the same, as I understand it. Just a speed-bin that Intel charges more to OEM mobo makers for the i875.)

While that may in fact be true, this new news does lead one to wonder if Intel is in fact going to implement strict anti-overclocking tech. This seems all the more ironic to me, having heard news a few months ago that Intel was looking into implementing a "system driver", kind of like NVidia, to allow overclocking of their chipsets and/or boards.

Wouldn't it be rather ironic, if Intel actually has implemented anti-overclocking tech, to prevent 3rd-party mobo makers from allowing OC'ing, but then on Intel's own "enthusiast" line of mobos, allow overclocking? Thus cornering the enthusiast/overclocker market all to themselves? Intel's no stranger to monopolizing markets, I think that we all know that. :p

Food for thought.

Edit: Here's a quote from the article:

Andrew Root, an analyst for Goldman Sachs Global Investment Research in New York, reported that only a small number of chip sets were affected, a number that was confirmed by an industry source. "As we understand it, the problem had (past tense because now appears fixed) to do with current leakage in the chipset's [real-time-clock] feature, and was encountered in certain printed circuit board designs," Root wrote in a note to clients Friday. "Intel's own?brand motherboards did not appear to have this issue.

Interesting to note that Intel's own boards didn't have this "issue", only 3rd-party OEMs.
 

stevty2889

Diamond Member
Dec 13, 2003
7,036
8
81
Wouldn't have been millions of chips any way, 5000 at most, as it was only 1 lot that wasn't properly proccessed.