- Sep 28, 2001
- 8,464
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I am slightly baffled by a "de-lidding i5/i7 and re-applying TIM" thread I found here where it turned out that MX-4 did exceptionally bad when used "on-die".
It seems that MX-4 is excellent when used for lidded CPUs, and up until a long while ago it was my notion that MX-4 "is among the best TIMs".
However, the thread in question found that when applied to CPU cores directly, (obviously) liquid metal is best in terms of temp, closely followed by IC Diamond. (ICD got a preference since its non-conductive)
MX-4 did 10 C (!!) worse as compared to those TIMs...
It was speculated that MX-4 has some sort of problem either with extreme heat from direct-die contact...or there may be other reasons at play which are beyond my scope. (Pressure from HSF maybe etc...)
My question here is now whether IC Diamond would ALSO show significant (an 8C - 10C difference I consider extremely significant!) temp differences when used for
* Laptop CPUs (since they don't use CPU lids)
* GPUs
All those are similar to the above mentioned i5/i7 delidding since the cores are all exposed. I just recently did a MX4 job on my wifes non-OC laptop - while it reduced temps somewhat the chip can still get VERY hot, like in the high 80s
Does anyone have a comparison how MX-4 and IC Diamond compares for GPUS and notebook CPUs?
It seems that MX-4 is excellent when used for lidded CPUs, and up until a long while ago it was my notion that MX-4 "is among the best TIMs".
However, the thread in question found that when applied to CPU cores directly, (obviously) liquid metal is best in terms of temp, closely followed by IC Diamond. (ICD got a preference since its non-conductive)
MX-4 did 10 C (!!) worse as compared to those TIMs...
It was speculated that MX-4 has some sort of problem either with extreme heat from direct-die contact...or there may be other reasons at play which are beyond my scope. (Pressure from HSF maybe etc...)
My question here is now whether IC Diamond would ALSO show significant (an 8C - 10C difference I consider extremely significant!) temp differences when used for
* Laptop CPUs (since they don't use CPU lids)
* GPUs
All those are similar to the above mentioned i5/i7 delidding since the cores are all exposed. I just recently did a MX4 job on my wifes non-OC laptop - while it reduced temps somewhat the chip can still get VERY hot, like in the high 80s
Does anyone have a comparison how MX-4 and IC Diamond compares for GPUS and notebook CPUs?
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