http://www.future-fab.com/content/PDF/FF36_Jan_11.pdf
Figured I'd post this up perchance there were two or three fellow forum members who have interest in this sort of thing

I'm still reading through it (more like "perusing it" at the moment) but the good stuff, for me, seems to start on page 72. (I'm biased though, having worked with both Joel and Jeff IRL)
Definitely get the impression that 20nm and above is viewed as "in the bag", but everything below 16nm is very much still up in the air. Which is pretty much "situation normal" for this industry.
Process tech to make nodes N+3 work are always a guessing game, have been for decades and yet we always pull through
Personally I still find it amazing that Intel is the only company to be shipping HKMG enabled CMOS...I never thought the gap in the timeline would be THIS lengthy.
Figured I'd post this up perchance there were two or three fellow forum members who have interest in this sort of thing
I'm still reading through it (more like "perusing it" at the moment) but the good stuff, for me, seems to start on page 72. (I'm biased though, having worked with both Joel and Jeff IRL)
Definitely get the impression that 20nm and above is viewed as "in the bag", but everything below 16nm is very much still up in the air. Which is pretty much "situation normal" for this industry.
Process tech to make nodes N+3 work are always a guessing game, have been for decades and yet we always pull through
Personally I still find it amazing that Intel is the only company to be shipping HKMG enabled CMOS...I never thought the gap in the timeline would be THIS lengthy.
