Ok, so I get my new Foxconn P965 motherboard and go to replace the stock NB heatsink with a Zalman NB heatsink. I unloop one side of the wire clip and the heatsink comes up...very easily as if there was no thermal pad, but grease used. I notice that HALF OF THE P965 CORE came up with it!
Foxconn used a thermal pad, so the heatsink should not have come up that easily and I don't believe I have seen a thermal pad so well attached that it would destroy the die. I *think* the die was cracked to begin with, as I applied no pressure at all and it came up extremely easily.
Needless to say, this sucks. Never had this happen before.
Is the P965 die THAT fragile or did I do something???
I have another board on order and am returning the first one, but now I am gunshy about removing the heatsink from the new motherboard for fear this may occur again.
Thoughts??
Foxconn used a thermal pad, so the heatsink should not have come up that easily and I don't believe I have seen a thermal pad so well attached that it would destroy the die. I *think* the die was cracked to begin with, as I applied no pressure at all and it came up extremely easily.
Needless to say, this sucks. Never had this happen before.
Is the P965 die THAT fragile or did I do something???
I have another board on order and am returning the first one, but now I am gunshy about removing the heatsink from the new motherboard for fear this may occur again.
Thoughts??
