Its a number of things.
Supply and demand on TSMC's part is definitely going to drive wafer contract prices in their favor.
At the same time, one of the key care-abouts captured by a node shrink development team is to engineer for lower cost of manufacturing.
But, since the beginning of the industry itself there has always been the opportunity for management and engineer alike to "bungle" their part of the development of a node and find themselves with a node shrink that costs way more than it really should when it goes to production.
Intel had Finfets in R&D for a long time before moving them to production, and for a good
economic reason.
Now that everyone else (except ST

) wants to jump on the Finfet bandwagon, they are naturally going to find the learning curve to be rather steep and fraught with all manner of cost-adders if they don't appropriately and responsibly manage the way they build cost into (or out of) their new finfet-enabled nodes during the development of the node.
TSMC may be taking advantage of the supply/demand situation created with their domination of the 28nm market, or they may have bungled things in development and built themselves an
Spruce Goose of a finfet node.
Either way, blaming the technology (finfet) for what are essentially business decisions and business management (whether it be either case or a mix of both) is kind of a lousy excuse.