Hello, I have a Thermaltake Tsunami all aluminum case (the silver without the window) and the right (when facing the front of the case) side panel has developed a little bump besause of a fall.Do you know or have any ideas on how to make this flat again?
If I heat the spot with a heat gun, will I be able to flatten it through pressure?
I feel really frustrated when I see it ,so please help!
Thanks.
If I heat the spot with a heat gun, will I be able to flatten it through pressure?
I feel really frustrated when I see it ,so please help!
Thanks.