First build, please help :)

[FirstTimer11]

Hi I have a question and I hope it isn't too stupid.

I'm building my first computer and I have most of it together. However I cant finish it until later in the week because of long hours at work.

So my question...

I have installed the CPU cooler. It is a H100 with a pre-applied thermal pad. I can't do any wiring until later in the week (Sunday) due to long hours at work. But am I supposed to turn the PC on after installing the cooler so the thermal pad spreads and applies to the CPU? Or can I leave it like that without turning the PC on at all until Sunday without any negative effect.

Sorry if that's a really dumb question but was curious. And I hope that made sense.

 

[rtsurfer]

Leave it till Sunday.
Everything will be fine.

The thermal paste will automatically spread when you normally start using your PC.
No need to leave the PC ON just to spread the paste.

 

[FirstTimer11]

So the thermal pad won't dry out if it's left like that on the CPU + Cooler without it being turned on to spread and apply?

 

[mikeymikec]

The thermal pad applying to the CPU isn't about ensuring that the two are stuck together, it's to fill the imperfect surfaces to ensure that the heatsink has as much contact with the CPU as possible in order to cool it in the most efficient fashion.

http://www.hardwaresecrets.com/article/How-To-Correctly-Apply-Thermal-Paste/274/2

No, it won't dry out, at least not in my experience. The only thing I'm aware of that dries out thermal paste is excessive heat (back in the days of AMD T-Bird CPUs, for example).

 

[rtsurfer]

So the thermal pad won't dry out or anything if it's left like that on the CPU + Cooler without it being turned on to spread and apply?

Nope.
The thermal paste doesn't try out till atleast a year.

I didn't change the paste in my first PC for 3 years.
Not advisable though.
Re apply the paste every 6-8 months.

 

[FirstTimer11]

I see. Thank you both. Sorry I hope that wasn't too stupid of a question. But I wanted to make sure leaving it like that until Sunday would be fine. Thanks!

 

[mikeymikec]

I didn't change the paste in my first PC for 3 years.
Not advisable though.
Re apply the paste every 6-8 months.

Perhaps this is good advice if you're overclocking, but I've seen PCs run for ten years without any noticeable effect on CPU temps.

 

[rtsurfer]

Its okay.
Forums are here so we can help each other.

Good luck with your build.

Perhaps this is good advice if you're overclocking, but I've seen PCs run for ten years without any noticeable effect on CPU temps.

Yes I do tend to run a OC.
But even when not OCing I think you should reapply the paste at least once maybe 2 years at a stretch.
When I took the stock Intel heatsink off my first PC after 3 years, I blew off 50% of the paste by just blowing at it.
The paste had basically dried to dust.

Good quality aftermarket paste like the one on OPs H100 might last longer.
But eventually the temps start rising.

 

[FirstTimer11]

Thank you Its going really well. Just wish I had some real time off so I can finish it.

 

[mikeymikec]

But even when not OCing I think you should reapply the paste at least once maybe 2 years at a stretch.
When I took the stock Intel heatsink off my first PC after 3 years, I blew off 50% of the paste by just blowing at it.
The paste had basically dried to dust.

1) Even if it had dried, that doesn't necessarily mean its ability to help dissipate heat had been significantly diminished - if it was still providing a solid surface between chip and HSF, it's probably still doing its job.

2) If the temps weren't affected (and assuming the HSF is free of dust), what's the problem?

I changed the stock heat paste on my 960T after it reached two years in the hope that I could reduce the CPU temps (and so therefore fan speeds), it made absolutely no difference.

Btw, you didn't mention what your first CPU was in your example, if it was a heat monster then that is a somewhat different scenario to what the average PC is like these days.

 

[rtsurfer]

1) Even if it had dried, that doesn't necessarily mean its ability to help dissipate heat had been significantly diminished - if it was still providing a solid surface between chip and HSF, it's probably still doing its job.

2) If the temps weren't affected (and assuming the HSF is free of dust), what's the problem?

Hmm.
Maybe you are right I guess.

The temps only raised after I too it off once, breaking the older contact surface.

Without that the effect of paste drying might have been very minute & can be ignored.