Huh? Any case can have positive or negative pressure unless it’s a really open one like the Lanboy Air, or a sealed hot-box. All those holes will either intake air or exhaust it.
Previously my Antec 902 would intake air through places like the side panel mesh, PCI slot covers, and through my PSU when its fan is off. Now it’s exhausting air in the same places because I have positive pressure.
The side panel filter never needs cleaning now, and there’s less dust inside the case overall because the only two places intaking air (front fans) both have dust filters.
No its not
Go check your front bays in the, see if it has dust near your cd rom.
Then check the corners of your case.
Im not done yet..
Then pull the front plastic plate off and check out how many places you got dust stuck into.
Think im done now?
NO...
Then you can inspect behind your board, and also the floor.
This isnt a sealed case.
Now take your case and look at a U4 case.
What you honestly are doing is telling someone who just entered the hobby that there is such a thing as possitive pressure and negative pressure.
Then he's going to read the old articles regarding + and - and superimpose that.
This is NOT what you should be teaching a new person in this hobby.
8 yrs ago i was using thermaltake cases... now i wouldnt touch them with a 10 foot pole.
8 yrs ago lian li V2000 series was one of the best cases, now its linked to heat traps in most systems because of the way they inverted the board and put that stupid shield over the cpu.
8 Yrs ago.... (meh im sounding like a broken record.. the point being + and - articles were writting longer then 8 yrs ago, and i cant think of case which we use today hasnt changed from 8 yrs ago.
That should tell you enough about the evolution of cases. The side pannel alone has evolved to complete shields.. then they added a small 80mm blow out.. then a 92mm blowout.. and then CM comes around and brings out 2 x 140mm blowout... This is the side panel ALONE evolving.
To anyone reading this thread...
IGNORE + and - pressure.
What works the best is getting cool air direct to your hottest spots, and then letting that hot air naturally escape though your many holes which the case vendors have placed.
This will net you the BEST results then - and + in cooling terms, becuase you get the freshest air.. (also why vendors put holes all over the place.. you can pull air almost anywhere).
Get the coolest air into your hottest parts... the hot air will escape naturally with the least amount of resistance... like a gaming case should do.
final example... b4 when i was a newbie to this area... it would be very difficult to get your case temperature inside near outside. This was typically the product of excellent wiring jobs.
But now. you dont need the wiring jobs anymore, because vendors like corsair and fractile for example design there cases arround wiring.
This leaves a lot of area's open for better circulation.
If a case was designed with pressure states involved... it would have shaped wind tunnels like a dell for example... you think that big green shield only cools the cpu? It uses a tunnel to get the entire board while pulling air from the front. (neg. pressure)
Now is your gaming case a dell case? NO WAY i dont think i would ever build my machine around that coffin.