- Jan 24, 2011
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Summary
Im trying to see how cool I can get my PC using air cooling. The ideal configuration so far has been replacing the stock heat sink with a Hyper 212 and using the rear case fan only. I am in the process of testing a duct idea. I am considering ways to cool the air before it enters the case and upgrading the fans.
Details
I had this PC:
Intel Core i5-2500K
Stock heatsink/fan
SAPPHIRE Radeon HD 6950 2GB
G.SKILL Ripjaws Series 4GB DDR3 1600 9-9-9-24
Crucial RealSSD C300 64GB SATA III
ASRock P67 PRO3
COOLER MASTER HAF 912
XFX P1-650X-CAG9 650W ATX12V 2.2
Microsoft Windows 7 Home Premium 64-bit
Before I switch over to water, I want to see what I can do with air cooling.
Here are the changes Ive made so far and what Ive gotten from them. To measure the effect of a change, I ran LinX, Prime 95, and SuperPi for 10 minutes. During the last minute, I took the average temperature measured using the software that came with my motherboard (ASRock Extreme Tuning Utility). Ambient temperature was measured by a thermometer on the desk above my computer.
1) I replaced the stock heat-sink and fan with a Cooler master Hyper 212 Plus with Arctic Silver 5.
In both cases, I let the bios control the clock (it chose 3.3 Ghz) and the voltage (it chose 1.216 Vcore).
60 degrees C: stock heat-sink (ambient 18 degrees C)
49 degrees C: Hyper 212 & AR5 (ambient 15.6 degrees C)
As an aside, one of the challenges Ive been facing is maintaining a constant ambient temperature. In NJ, the weather has been really inconsistent and Im too cheap to pay for heating. Ive tried opening and closing my windows to various degrees, but its not very precise. Any ideas?
2) I experimented with various degrees of case enclosure.
In all cases, I set clock to 4.7 Ghz (47 * 100), voltage to 1.35 Vcore, short & long duration power limits to 500.
70 degrees C: default case (ambient 17.5 degrees C)
65 degrees C: open casetop, sides, and pci slot covers removed (ambient 17.5 degrees C)
72 degrees C: sealed caseI taped cardboard over all holes in the case without fans in them (ambient 18 degrees C)
3) I experimented with different case fan locations (I was inspired by this article http://tech.icrontic.com/articles/pc_airflow_heat_cooling_guide/)
In all cases, I set clock to 4.7 Ghz (47 * 100), voltage to 1.35 Vcore, short & long duration power limits to 500. The case fans are Coolermaster A12025-12CB-3BN-F1 fans (120 MM, 1200 RPM, 44 CFM, 19 dB). I managed to keep ambient at 18.9 degrees C for all of these trials.
65 degrees C: one fan low in the front and one fan high out the back (default HAF 912 configuration)
60 degrees C: one fan high out the back
65 degrees C: one fan high in the front and one fan out high in the back
66 degrees C: one fan high out the back and one fan out the top of the case
66 degrees C: one fan out the top
67 degrees C: one fan low in the front
67 degrees C: one fan in from the side
4) A co-worker suggested that I try a duct. His argument was that doing so would allow me to maximize the rate that air flowed past the heat-sink (and consequently convection).
65 degrees C: one fan low in the front and one fan high out the back (ambient was 18.9 degrees C)
67 degrees C: duct as pictured below (ambient was 17.8 degrees C)
http://postimage.org/image/2akrrc3o/
I wasnt thrilled with this result, but there were a couple of issues with this version of the duct.
-I couldnt bend the duct from the heat-sink to the back of the case such that it lined up perfectly with the rear case fan hole (about half of the cross section is blocked). Im thinking about taking a hole saw to the case, though would be open to a non-case damaging alternative.
-Also, the seals in the couplings that I machined werent perfect. Im going to seal them with Loctite high temperature RTV.
-Im not convinced that the ideal duct fan configuration is one on the heatsink and one in the rear. Id like to try out a couple of different configurations to see what works best. If I had to guess, I would think based on my experience with fan configurations in the case that back only would be best.
5) Other things to try
-One idea I was kicking around was finding a way to cool the air before it is taken into the case. I was thinking of either something like an electrically cooled lunch box (like the Koolatron P20 http://www.google.com/products/cata...=X&ei=uMSLTd61HIi30QGH45ijCw&ved=0CD4Q8gIwAA#) or a mini-fridge. My concern with these is the huge amount of electricity needed to generate heat.
-Another direction is changing up the fans I have. My 120mm heat-sink fan only moves about 75 CFM. I bet I could find something that moves more air but that doesnt sound like an air plane.
Which of these do you think is most promising? Can you think of a better idea?
Im trying to see how cool I can get my PC using air cooling. The ideal configuration so far has been replacing the stock heat sink with a Hyper 212 and using the rear case fan only. I am in the process of testing a duct idea. I am considering ways to cool the air before it enters the case and upgrading the fans.
Details
I had this PC:
Intel Core i5-2500K
Stock heatsink/fan
SAPPHIRE Radeon HD 6950 2GB
G.SKILL Ripjaws Series 4GB DDR3 1600 9-9-9-24
Crucial RealSSD C300 64GB SATA III
ASRock P67 PRO3
COOLER MASTER HAF 912
XFX P1-650X-CAG9 650W ATX12V 2.2
Microsoft Windows 7 Home Premium 64-bit
Before I switch over to water, I want to see what I can do with air cooling.
Here are the changes Ive made so far and what Ive gotten from them. To measure the effect of a change, I ran LinX, Prime 95, and SuperPi for 10 minutes. During the last minute, I took the average temperature measured using the software that came with my motherboard (ASRock Extreme Tuning Utility). Ambient temperature was measured by a thermometer on the desk above my computer.
1) I replaced the stock heat-sink and fan with a Cooler master Hyper 212 Plus with Arctic Silver 5.
In both cases, I let the bios control the clock (it chose 3.3 Ghz) and the voltage (it chose 1.216 Vcore).
60 degrees C: stock heat-sink (ambient 18 degrees C)
49 degrees C: Hyper 212 & AR5 (ambient 15.6 degrees C)
As an aside, one of the challenges Ive been facing is maintaining a constant ambient temperature. In NJ, the weather has been really inconsistent and Im too cheap to pay for heating. Ive tried opening and closing my windows to various degrees, but its not very precise. Any ideas?
2) I experimented with various degrees of case enclosure.
In all cases, I set clock to 4.7 Ghz (47 * 100), voltage to 1.35 Vcore, short & long duration power limits to 500.
70 degrees C: default case (ambient 17.5 degrees C)
65 degrees C: open casetop, sides, and pci slot covers removed (ambient 17.5 degrees C)
72 degrees C: sealed caseI taped cardboard over all holes in the case without fans in them (ambient 18 degrees C)
3) I experimented with different case fan locations (I was inspired by this article http://tech.icrontic.com/articles/pc_airflow_heat_cooling_guide/)
In all cases, I set clock to 4.7 Ghz (47 * 100), voltage to 1.35 Vcore, short & long duration power limits to 500. The case fans are Coolermaster A12025-12CB-3BN-F1 fans (120 MM, 1200 RPM, 44 CFM, 19 dB). I managed to keep ambient at 18.9 degrees C for all of these trials.
65 degrees C: one fan low in the front and one fan high out the back (default HAF 912 configuration)
60 degrees C: one fan high out the back
65 degrees C: one fan high in the front and one fan out high in the back
66 degrees C: one fan high out the back and one fan out the top of the case
66 degrees C: one fan out the top
67 degrees C: one fan low in the front
67 degrees C: one fan in from the side
4) A co-worker suggested that I try a duct. His argument was that doing so would allow me to maximize the rate that air flowed past the heat-sink (and consequently convection).
65 degrees C: one fan low in the front and one fan high out the back (ambient was 18.9 degrees C)
67 degrees C: duct as pictured below (ambient was 17.8 degrees C)
http://postimage.org/image/2akrrc3o/
I wasnt thrilled with this result, but there were a couple of issues with this version of the duct.
-I couldnt bend the duct from the heat-sink to the back of the case such that it lined up perfectly with the rear case fan hole (about half of the cross section is blocked). Im thinking about taking a hole saw to the case, though would be open to a non-case damaging alternative.
-Also, the seals in the couplings that I machined werent perfect. Im going to seal them with Loctite high temperature RTV.
-Im not convinced that the ideal duct fan configuration is one on the heatsink and one in the rear. Id like to try out a couple of different configurations to see what works best. If I had to guess, I would think based on my experience with fan configurations in the case that back only would be best.
5) Other things to try
-One idea I was kicking around was finding a way to cool the air before it is taken into the case. I was thinking of either something like an electrically cooled lunch box (like the Koolatron P20 http://www.google.com/products/cata...=X&ei=uMSLTd61HIi30QGH45ijCw&ved=0CD4Q8gIwAA#) or a mini-fridge. My concern with these is the huge amount of electricity needed to generate heat.
-Another direction is changing up the fans I have. My 120mm heat-sink fan only moves about 75 CFM. I bet I could find something that moves more air but that doesnt sound like an air plane.
Which of these do you think is most promising? Can you think of a better idea?