Direct contact heatsink uneven heat dissipation (Hyper TX3).

[ironk]

I am looking at the bottom of the Hyper TX3 from coolermaster:

http://www.coolermaster.com/cooling/cpu-air-cooler/hyper-tx3/

I see that it has three heatpipes at the bottom. The problem looks to be that there is a copper pipe, then there is a gap of (aluminum?) then another copper pipe, then another gap and so on. Doesn't this mean that some part of the cpu will be hotter than where there is a copper pipe at the bottom and where there isn't? It looks like coolermaster website alludes to this problem too:

http://us.coolermaster.com/product/Detail/cooling/am3-cooler/hyper-212-evo.html

(at the bottom where it mentions CDC vs Direct contact)

If this is a problem, when why get something that may even damage the cpu like the tx3?

 

[BonzaiDuck]

I am looking at the bottom of the Hyper TX3 from coolermaster:

http://www.coolermaster.com/cooling/cpu-air-cooler/hyper-tx3/

I see that it has three heatpipes at the bottom. The problem looks to be that there is a copper pipe, then there is a gap of (aluminum?) then another copper pipe, then another gap and so on. Doesn't this mean that some part of the cpu will be hotter than where there is a copper pipe at the bottom and where there isn't? It looks like coolermaster website alludes to this problem too:

http://us.coolermaster.com/product/Detail/cooling/am3-cooler/hyper-212-evo.html

(at the bottom where it mentions CDC vs Direct contact)

If this is a problem, when why get something that may even damage the cpu like the tx3?

I doubt that, seriously.

You can do a couple things.

You can lap the HSF base of the TX3 a bit, to improve contact.

You can choose my own preference for TIM: ICD diamond paste. And you can fill the gaps with the micronized diamond. It won't "pump out;" the particles will stay jammed together in the spaces.

The TX3 is compact -- for sure. It requires a 92mm fan, and I'm wondering what I could do with a 92mm Delta fan I have in my parts locker. I could probably stifle the noise enough to make it work. I just don't see a need, though, for using anything smaller than the 212 EVO.

Unless, of course, you want the added ease of the locking mechanisms used on the stock Intel HSF. That would only be helpful when changing motherboards or processor platforms -- AMD vs Intel or vice-versa. With any other more elaborate heatsink assembly, you can just as easily remove the cooler for cleaning or TIM refresh.

 

[ironk]

I wonder why is it that they don't make flat bases for heatsinks anymore. Its actually very difficult to find one now...

I just think it makes more sense to have a flat area contacting the cpu rather than having "gaps" here are there. The pipes like that at the bottom may or may not work properly, and I guess its a difficult thing to research. However, going just by the looks, it doesn't "feel" like a good idea for them to have a heat pipe design at the bottom.

Here is a pic from their own website about it:

http://i.imgur.com/15OCx7B.png

 

[BonzaiDuck]

I wonder why is it that they don't make flat bases for heatsinks anymore. Its actually very difficult to find one now...

I just think it makes more sense to have a flat area contacting the cpu rather than having "gaps" here are there. The pipes like that at the bottom may or may not work properly, and I guess its a difficult thing to research. However, going just by the looks, it doesn't "feel" like a good idea for them to have a heat pipe design at the bottom.

Here is a pic from their own website about it:

http://i.imgur.com/15OCx7B.png

Oh -- I see. The "gaps" you spoke of are really adding aluminum to the equation, so to speak. It wouldn't matter so much if the base of direct-touch heatsink bases used all copper.

 

[ironk]

yes, I mean, they have aluminum gaps then copper. To me, it would be better if the base was uniform rather than with gaps because it looks like the cpu will be hotter in the aluminum areas always.