"Dings" on lidded processors affecting cooling?

[Aries64]

Does anyone out there with a "lidded" processorhave any evidence that small "dings" or dents on the top of the IHS (Integrated Heatsink) leads to reduced cooling efficiency? Not microscopic-level imperfections - I'm talking about dings that are clearly visible to the naked eye.

Assuming that the dings are minor and that you are using a properly applied high-performance TIM (thermal interface material) combined with a proper HS (boxed AMD HSF or XP-90 and 92mm fan) you really shouldn't worry about cooling right with a minor overclock right?

I've seen OEM FX-55s' with imperfections such as I've mentioned and I wonder how the dings may affect the cooling, as AMD rates the FX-55 at 104W. Also, I can't remember now but I thought I saw someplace on the net' a while ago that AMD raised the spec on the FX-55s to 115W! Maybe I'm just remembering incorrectly, maybe it was BS. Dunno.

 

[CalvinHobbes]

It shouldn't make any difference as long as the TIM is applied correctly.

 

[Leper Messiah]

it depends on how many are there, and what the surface area is. If its a signifcant portion of the IHS, then, yes, it could impact cooling, as the surface wouldn't be in contact with the HSFU. You could try sanding them down, if you don't mind losing your identification marks.

 

[Aries64]

Originally posted by: CalvinHobbes
It shouldn't make any difference as long as the TIM is applied correctly.

Thats what I figured.

it depends on how many are there, and what the surface area is. If its a signifcant portion of the IHS, then, yes, it could impact cooling, as the surface wouldn't be in contact with the HSFU. You could try sanding them down, if you don't mind losing your identification marks.

Not a significant portion of IFS at all - just three small marks so I won't worry about it. Thanks for the replys!