Hi
Garzhad, welcome to the forums! :thumbsup:
Has anyone done this and used a high-end air cooler like the Phanteks TC14PE?
http://www.newegg.com/Product/Produc...82E16835709001
I've got that and an i5 3570k that i'm contemplating delidding after I get my system built.
I don't recall if anyone here has reported their delidding results with that specific HSF, but it is in the same caliber as a NH-D14 and results with that high-end air cooler are available throughout this, and other, threads in the forum.
I'll gladly link you to specific posts of interest if that is something you are interested in seeing. But if you are specifically looking for results with the TC14PE then we'll just have to hang out a bit and see if another member chimes in with some links or results.
Probably going to at least lap the IHS top and the HSF(I think it's the kind of HSF you can lap, i don't recall seeing anything about it being direct touch?) But I really don't see any feasible way to lap the bottom of the IHS properly.
People have reported success in lapping the inside of their IHS by taking a tiny stick of wood (0.25" on edge) and covering the end with sand paper and then swishing it back and forth to remove the rough surface and get down to copper.
But it doesn't appear to deliver any sort of benefit. You get 80% of the benefit of delidding just from eliminating the gap, another 20% can be had in picking a great TIM like Liquid Ultra. Getting beyond that, lapping the inside of the IHS, starts giving you single-digit returns but at the expense of out-sized levels of effort on your part.
Personally I never bothered to lap the inside of my IHS. For two reasons - the effort did not seem justified based on reports from people who had done it. And secondly I am actually not all that keen about putting copper directly on the bare silicon die. Yes I did it for my tests, but that was done in the name of generating data and not done in the name of creating a 24x7 machine capable of functioning for 3-4 yrs.
Copper on bare silicon is a recipe for early chip death. So you have to weigh that added risk when deciding what is best for you. OC'ing is not without risk, adding voltage and delidding is not without risk. So in the grand scheme of things the risk-adder of putting copper on your die may not be all that much incremental risk.
That said, I know IDC and most of the others just lock the unsecured IHS down with the retention bracket, but has anyone tried gluing it back down afterwards and recorded what, if any difference in temps, the re-glued IHS makes compared to the free-floating one, and what material they used?
I would figure that as long as you made sure the adhesive didn't lift the IHS off the die before it hardened it wouldn't make a difference, but would help keep the IHS corners from bending around the die from the pressure exerted by the HSF mounting bracket.
Having played around with delidded Ivy Bridge CPUs for a while (three 3770k's so far) I personally have not had any reason to glue the IHS back down onto the delidded processors. Once they are latched into the socket retention mechanism they are truly going nowhere.
But if I were truly intent on gluing it back down then I would use the socket retention mechanism to my advantage in pressing the IHS down with the needed downforce to eliminate as much of the gap as possible.
So what I would do is prepare the CPU and IHS as a delidded CPU but I would add a bead of adhesive to the IHS lip before placing the IHS back down onto the CPU PCB (while the CPU is in the socket). Then I'd lock the socket clip, pushing that IHS down close to the PCB right where I want it. Then I'd mount my HSF to add even more down pressure.
Then I'll know the gap is as minimal as possible, and whenever I do remove the HSF and take the CPU out of the socket then the IHS will be stuck fast to the PCB.
Generic superglue is probably good enough for the task IMO.