I would enjoy doing it but it isn't in the cards right now.Hey idc are you gonna do delid and oc the hell out of haswell by chance? Not interested in the results for myself but i just love reading your "articles"
If the TIM remove actually doubles as chewing gum, that's just Intel tipping its hat towards the enthusiasts.I would enjoy doing it but it isn't in the cards right now.
I'm sure I would be more motivated to find a way to make it happen if 22nm wasn't such a dud at the high-end versus 32nm (just thinking of my IB vs SB experience)...so for now I have my sights set on 14nm.
And if the current trend is any indication of things, 14nm will likely come with a 1cm gap between CPU and IHS and it will be filled with chewing gum So the hobbyist will really have something to chew on while delidding
Dear IDC please help..^^To the guy in post # 1000, you did though clean the die and the underside of the water block before attachment to the cpu. Also, the water block needs to have firm contact with the die. That is, it shouldn't be gorilla torqued to it, but should not be finger tight either. Finally, you are using something in between the dye and water block?
Hi sanurocks,Dear IDC please help..
Any one experienced please help me..
Yes i cleaned it with ipa 99%.. Every time.
Right now using noctua tim between die ihs and ihs h80i.
And please tell that will i risk the die if ihs is used above it as there is some space between it and the pcb..
Also please suggest the best tim to use between die and ihs(i am going to keep ihs on).good tim which are available in my country are
Cm thermal fusion 400,essentials e1,e2,x1
Arctic silver 5,cremique 2
Antec formula 7
Just the above are available.i am able to import gelid extreme,arctic mx-4 but it will take 2-3 weeks for delivery.
I currently have noctua, cm tf400, deepcool z5.
I'm recommending ceramique2 only because I have used it and no one has reported issue with it on the bare die. The other TIMs may be superior, but I can't say for sure so I can't recommend them.Sorry for long post.. but i am concerned.
Yes i cleaned everything.glue,previous tim everything.
ok i got the point. there is no risk in running Ihs on the die because the pressure from the mounting bracket adjusts it...
Dear IDC i can get ceramique 2..
but are you disregarding gelid gc extreme due to pump out effect?(Delivery time not being and issue)Also now i checked i can get Phobya HeGrease Extreme,prolimatech pk-3,IC diamond too(but as i can see ic diamond scratched your die).Long story short i can get all the tim except coollaboratory one's and any liquid metal tim.
so of all the tim please suggest the tim which will work good for atleast 4-5 months pumping out taken in account. i will re apply it, as i clean my system(except tim) thoroughly every 2 months.
After finalizing the paste i will do lapping.
A valid concern, true, but no one to date has reported it with Ceramique so I think you are safe.i was concerned because in your testing post you have mentioned that it is so thin that it may suffer pump-out effect same as as5..
nonetheless i ordered one.
thank you for valuable input.
That is a good plan. Get CLU if possible since it is the best of the best, but CLP is OK as well.Actually there is no distributor of coollaboratory products in india..
Local shops and online megastore like amazon and ebay have same inventory just price difference..i live in a developed urban area.
newegg says that clp has been discontinued and 0 pieces in stock..
i think i might get one from frozen cpu the total cost would be $27-$28.it will take 3-4 weeks.. for that time period shall i use deepcool z5..wait for clp and then replace it?
what do you suggest?
Sorry, no experience with Antec formula 7, but if it has abrasives in it like diamond paste then yes I would be worried about putting that in direct contact with the silicon die.This will be probably my last question regarding this..
Do you have any idea regarding antec formula 7.. Though the performance is on par or better than ic diamond(courtesy many non english review sites)I have one concern, being a nano diamond containing compound will it also scratch the die.?
Yeah the tests show that pretty much any replacement TIM will work provided you can get it to be much thinner than the stock TIM thickness...but we have seen to many forum members report pump-out issues with both AS5 and NT-H1 that it makes it easy to (now) just recommend people spend a little extra and get the Liquid Ultra or Pro.ok i will look for ultra..
thanks for the help..
And after spending days and nights of researching as well as your test suggest that realistically any high quality tim would suffice to be used with ihs in place..
bare die its CLU/CLP/any liquid metal no questions asked..
thanks for all your help.
Ok.got the point..Seems rather hot for stock voltages at 4.3GHz. You may just have a CPU that barely made it through the binning process (meaning it burns more power and requires more volts to function at any given clockspeed).
That voltage is the problem, quite high for a 4.3GHz OC.Btw the stock voltage for my board is 1.236V.turbo overclocked 4.3 ghz..
Exactly.Next thing to do is change the tim and lap the h80i.