Exactly what I was thinking too.My findings mirror yours, IDC. My gap must have been very small, because delidding and remounting the IHS with aftermarket paste resulted in a 2-3c rise in temps at high overclocks.
4.6ghz, ~1.304v, LinX loaded:
Unmolested CPU: ~98c
TIM replaced under lid: ~100-101c
Bare die: ~95c
Surprisingly, the IHS itself wasn't hurting temps as much as I suspected either. The paste has had time to settle in for about 18 hours after I lapped my WB and I'm only 3-4c below where I was at stock.
Yep, got the bolts already for my H100 direct-die tests! Next on my list. Try not to delid yourself in the meantimeAwesome update IDC. While I don't think I'll ever de-lid myself, reading your very thorough work is very interesting and educating.
Do we get to look forward to that H100 mounted on the die?
Hmmm...De-lid myself could be read a couple of different ways