- Sep 20, 2010
Idc just a thought, I remember some of the older IHS's had a small hole maybe to allow for air expansion, pressure build up. Idk if the IVB IHS is purged when assembled. Do you think this could be an effect when reassembling the IHS?Two things can be happening, and possibly in combination.
One is the push-pull pumping effect that comes with the mechanical expansion and contraction of the silicon, the TIM, and the overhead IHS. Eventually, given time, the TIM itself will be squeezed out of the gap that it occupies between the die and the IHS and an air gap will be left in its place. The air gap most likely forms when the CPU cools down.
Then when the CPU heats back up, the air gap prevents the IHS from heating up in concert with the die and the TIM, resulting in an IHS that is not expanding to fill in the air gap, leaving the CPU much hotter than before.
The second point of concern is that of emulsion separation - the molecular components that comprise NT-H1 may experience separation at the behest of the silicon die interaction (it will actually be a silicon nitride at the surface). NT-H1 was probably not designed to remain an emulsion when in contact with silicon as it was designed to remain an emulsion when in contact with copper, aluminum, or nickle (more specifically, the metal oxides of those elements).
So a chemical separation may be the culprit as well, and likely it is a combination of both.