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CUSL2 question, the green heatsink on the board is said too get very hot...

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Detoyminador_

Senior member
is it fixed with thermal compound or thermal tape? if not i'll apply thermal compound and a fan above it. would this really help in overclocking it more stable???????????
 
With the older BX boards that was a good trick (thermal compound between heatsink and chipset) it did help with stability on them. I have a CUSL2 w/700e @ 1Ghz and have checked the chipset heatsink and it is not even warm... "BUT" the PLL chip (beside the memory banks-Right hand side) is a different story kinda like the P3V4X with ICS clock generator it needs a heatsink (frick`in hot)

Also the heatsink is attached by 2 plastic pins which are kinda hard to pop loose but can be pulled with good needle nose pliers from the componet side of the board...
 
zipperhead, i noticed on your pic c2.jpg you place4d a heat-sink on that chip near the ram like bartman was saying. did you notice any improvement in clock speed at all by doing this?
 
Presumably the GMCH (North Bridge, whatever) should be able to handle the heat generated not only by the normal operations but also by the integrated i752. Since we are not using the integrated video, you would think that the temperature of the chip should be well within tolerance levels right? The heatsink is only warm for me.....not particularly hot.
 
I am still confused on where the ICS clock generator chip is, the chip that is supposedly getting REALLY hot! All I see on my board is the green heatsink and I thought that is the "chipset" chip (C2 pic). The green heatsink on my board is not even warm, but on my previous MSI 6163 pro it was scorching! (50 degrees C with a thermistor). So is the ICS clock generator the same thing as the green heatsink chip?
Zipperhead, do u have a picture of the clock generator?
 
Oh....you mean the ICS clock generator? Yes...that does get VERY hot. Since people were claiming they were able to reach higher FSBs when they cooled it on the P3V4X, I assume that the effect would be the same.

However, the ICS clock generator on the P3V4X was replaced with a Winbond chip later....and the CUSL2 was manufactured after this change was made, so you would assume that the tolerances on this new ICS chip would be better, as it can generate higher clock speeds than the P3V4X ICS chip can.

Still, putting a heatsink on very hot components is probably a good idea....even if it doesn nothing for stability, it will increase the lifespan and reduce stress on the components nearby.
 
zipperhead, what did u use to fix the heatsink too your clock gen chip, thermal tape or thermal epoxy, i'm also thinking about fixing a 40mm fan above it as well.
 
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