Oh....you mean the ICS clock generator? Yes...that does get VERY hot. Since people were claiming they were able to reach higher FSBs when they cooled it on the P3V4X, I assume that the effect would be the same.
However, the ICS clock generator on the P3V4X was replaced with a Winbond chip later....and the CUSL2 was manufactured after this change was made, so you would assume that the tolerances on this new ICS chip would be better, as it can generate higher clock speeds than the P3V4X ICS chip can.
Still, putting a heatsink on very hot components is probably a good idea....even if it doesn nothing for stability, it will increase the lifespan and reduce stress on the components nearby.