- Jan 30, 2005
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I have a standard PC case which has the side cover permanently off. My heat sink a Thermalright Ultima 90 is too tall to close the cover. My computer has a Core 2 duo E6300 clocked at 3.2ghz. At idle the temperature is about 35c. Under load it will go to 72c. I have a 120mm fan connected to the heat sink which cranks up to 1600 rpm when under load. I was wondering because the case is a typical tower style case the heat sink is not really above the CPU. Of course it's bolted down on top of it, but when in the case it's really on its side in relation to the floor. I think that a lot of heat sink reviews are conducted with the motherboard laid flat on a workbench and not sitting in a tower case where the orientation of the motherboard is perpendicular to the floor. Is there a noticeable difference in heat dissipation between a heat sink mounted on a cpu where the motherboard is laid out flat to that of one where it's situated in a tower case and perpendicular to the floor? Is it possible to see some reviews with pictures taken in the infrared spectrum of heat sinks functioning in the configurations mentioned? In my thinking, I don't think tower type cases present the ideal cooling solution. Something more like a HTPC case but designed with overclocking in mind seems to me to be the better design for heat dissipation. Any ideas?