Cpu (heatpipe) heatsink orientation with die affect cooling?

[bononos]

Has the smaller die sizes made the orientation of cpu heatsinks utilizing heatpipes more important to cooling performance?
For example, the narrow rectangular die of ivy/haswell might mean that some Intel cpu heatsinks (eg TX3, 212+) might cause the outer heatpipes to miss the sweet spot. Would a better way be to re-orient the heatsink horizontally to put the heatpipes running across the cpu (instead of running lengthwise parallely)?. Has anyone done such testing?

 

[KingFatty]

Interesting, but no I've only heard about the testing focusing on how the orientation of the heatsink directs the airflow. So to ensure the test was checking for this specific phenomenon, I would hope the test would use a bare motherboard flat on a test bench, outside of a case, to where the airflow direction would be irrelevant and not change the heating.

But, I would also think that in a heatpipe heatsink, the heatpipes themselves will transfer heat to each other very efficiently in the base, so if the heat is focused on the middle pipes, the outer pipes would just suck their share of heat away from the inner pipes.

 

[BallaTheFeared]

I thought the same, in fact I had it setup that way at first.

But my cpu temps have never been a problem so I switched it to get some air on the back of my video card.

I didn't do a before and after temp test though.

 

[tweakboy]

Your thinking too much. Install it and forget it. That is my motto

 

[Brahmzy]

In short, no.

 

[amitkher]

Easy to say no (or yes), but it is an important question and needs answer. Along with the small die, low conductivity material between die and heat spreader could very likely have changed the dynamics of CPU cooling. Surprisingly, and unfortunately many cooler reviews are using sandy bridge CPUs even in 2013.

From the limited reviews focussing on haswell, I already notice some changes. E.g. ( http://www.tomshardware.com/reviews/best-heat-sink-haswell,3554.html) shows direct touch coolers at a disadvantage. Not enough to answer the question of this thread, of course.

 

[bononos]

http://www.hardwaresecrets.com/article/Which-is-The-Best-Position-for-a-Tower-CPU-Cooler/1815/3
The above testing shows some fairly significant differences btwn vertical/horizontal mountings but I think the difference might've been due to diff airflow patterns.

 

[amitkher]

http://www.hardwaresecrets.com/article/Which-is-The-Best-Position-for-a-Tower-CPU-Cooler/1815/3
The above testing shows some fairly significant differences btwn vertical/horizontal mountings but I think the difference might've been due to diff airflow patterns.

Your question was about ivy/haswell, but this uses sandy bridge processor. Like I said, ivy/haswell CPU cooler reviews are rare - most use sandy. Sandy had reasonable material between die and heat spreader, unlike ivy /haswell.

 

[bononos]

Easy to say no (or yes), but it is an important question and needs answer. Along with the small die, low conductivity material between die and heat spreader could very likely have changed the dynamics of CPU cooling. Surprisingly, and unfortunately many cooler reviews are using sandy bridge CPUs even in 2013.

From the limited reviews focussing on haswell, I already notice some changes. E.g. ( http://www.tomshardware.com/reviews/best-heat-sink-haswell,3554.html) shows direct touch coolers at a disadvantage. Not enough to answer the question of this thread, of course.

Yeah there are sites which use heat-plate type things to simulate cpu heat as well.

Theres the factor of poorer performing tim (vs solder) being used by Intel which exacerbate the differences btwn heatpipe orientation.

 

[bononos]

......

 

[bononos]

Your question was about ivy/haswell, but this uses sandy bridge processor. Like I said, ivy/haswell CPU cooler reviews are rare - most use sandy. Sandy had reasonable material between die and heat spreader, unlike ivy /haswell.

True, I just wanted to throw it in there to outline the issues but now I think it would just messy up the thread.

These is the issue in my OP:
- small die size, orientation, direct touch vs flat base (1)
- typical 1 dot/line tim application not enough for outer direct touch heatpipes related to (1)
- can outer heatpipes in flat base design pick up enough heat from (1)

 

[Imouto]

http://www.overclockers.com/thermalright-venomous/

At the end of the page.

 

[KingFatty]

Ah interesting. So that heatsink had a convex base too, though I don't think that mattered here.

But can someone clarify how he described the optimal orientation for the rectangular dies? I think he said you put the flat axis of the heatsink along the longer rectangular axis of the die?

So I guess because the heat pipes are perpendicular to the flat axis of the heatsink, you get the most heat pipes going over the rectangular die that way? Because if you orient the other way, I guess the heat pipes would be going along the same direction of the long part of the rectangle, so the outermost heat pipes would "miss" the die?