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cpu and thermal compound question

I was given a cpu/mb/ and ram from a customer that was sick of messing with it.. Turns out it was just a bad motherboard.. I tested the cpu in several other motherboards and it worked just fine, as well as did memory tests..

I've noticed that the thermal compound is almost gone, i guess from continually removing the cpu, etc... I just ordered a new motherboard, and when testing it, the machine starts to boot up but within about 3 seconds it shuts back down.. much like it will do if the heatsink isn't attached...

I'm guessing that since the thermal compound is almost gone, there isn't a good enough of a bond between the cpu and heatsink for it to be effective enough... its all dried up and there just isn't much left...

sound reasonable? I'm at work right now and don't have any to test it with.. but I'm going to pick some up on my way to work..

ps, its a p4
 
If the heatsink is making good contact, then you shouldn't need any thermal compound to post. Either you've got the heatsink fan header plugged into the wrong 3 pin lead, or perhaps a memory or power supply issue.
 
Dried up can't be good, that may keep the two pieces physically separated from each other. It certainly could be a problem - even just a millimeter apart means no contact and no cooling.
 
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