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Discussion Could AMD be the first company to use custom HBM?, sorry I'm using a translator.

AMD do it?

  • yeah

    Votes: 3 100.0%

  • nope

    Votes: 0 0.0%

  • 3Ѕtar

    Votes: 0 0.0%
  • Total voters
    3
1250

1250

Member
https://twitter.com/x/status/2013487091712245851
At least in X it seems like there is a high possibility of using custom base die (aka b-die)
I was wondering if it was a long time ago, 24*lpddr5x appeared.
If you want to know more about hbm4 and custom hbm, I can tell you as much as possible
(hbm process, c-die, joe, Samsung Hynix employees' perspectives on AMD)
Of course I'm just an AMD gpu fanboy. only a few of them in Korea.
BTW ask me, i hope fiji moment and longlong timeago tiran
 
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below problem e.g.
1. Development costs exceed $100M, making it inefficient.
2. The base die cannot be made compatible with the core dies of the three memory companies.
3. Insufficient capabilities.(amd, I didn't say that.)
4. Custom HBM starts with HBM4e (Samsung and Hynix have created dedicated custom HBM teams)
5. Possibility - Dualization of core die. (aka c-die) problem of stock
 
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1250 said:
below problem e.g.
1. Development costs exceed $100M, making it inefficient.
2. The base die cannot be made compatible with the core dies of the three memory companies.
3. Insufficient capabilities.(amd, I didn't say that.)
4. Custom HBM starts with HBM4e (Samsung and Hynix have created dedicated custom HBM teams)
5. Possibility - Dualization of core die. (aka c-die) problem of stock
Click to expand...
all prior comments by AMD execs have claimed that CDNA 5 would be ready by June this year
 
The compromise is that the Samsung combination and the TSMC combination competed and the Samsung combination (custom B-die) was defeated. What do you think?

tsmc MID+bigger I/O or Samsung MID + I/O + C-HBM
 
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adroc_thurston said:
yes this is literally MI455X.
Click to expand...
I don't know anything, but I suspect it's Micron. It was the only DRAM process base die, and it moved to 12nm in 4e.
What are your thoughts?
Are they using C-HBM, which supports C-dies from three companies, or is it a dual-structure design (Samsung or TSMC MID)?
I'm still using C-HBM, but I'm concerned about the unit price. S-HBM might be a better choice.(Memory guys)

P.s You can give a short answer, I don't care
Or is there something I should say to these memory guys?
 
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With the strike risks at Samsung growing, do you think Lisa Su has prepared well for it?
 
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