- Jul 7, 2000
- 1,980
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I am trying to get my new VP6 rig as high as possible (don't we all?). Dual PIII-700 cB0. With 1.75V it runs at 133 FSB -> 933 MHz. There are no high-heat boards (simple CL 5645 AGP video, sound, network, modem). Only one HD at this time, although I will add more 7200 RPM Maxtors.
At this time the mid-tower case has an 80mm intake fan in the front bottom, and I drilled through the plastic front to let air in. When the case is open, or without the plastic on the front, under load I get to 37 C. With the case closed and the plastic on I get to 43 C. I know I need to improve the hole in the front plastic. I am not interested in drilling the side metal panels for more fans, although I could do it for going over a GHz
My question: What should I do in the back of the case? There is a vertical strip of holes running next to the PCI-card bracket screw ledge. I can close these holes completely with tape, I can add a small fan over some of the holes exhausting air, or I can turn the fan around and input air.
Any opinions?
JesseKnows
At this time the mid-tower case has an 80mm intake fan in the front bottom, and I drilled through the plastic front to let air in. When the case is open, or without the plastic on the front, under load I get to 37 C. With the case closed and the plastic on I get to 43 C. I know I need to improve the hole in the front plastic. I am not interested in drilling the side metal panels for more fans, although I could do it for going over a GHz
My question: What should I do in the back of the case? There is a vertical strip of holes running next to the PCI-card bracket screw ledge. I can close these holes completely with tape, I can add a small fan over some of the holes exhausting air, or I can turn the fan around and input air.
Any opinions?
JesseKnows