Built many computers but never seen pics of thermal paste spread on HSF

[netjack]

I've build several computers using Arctic Silver 5 and always only evenly spread a pea/rice grain sized drop across the HSF. Tried to make sure the spread was even and could never see any the HSF's metal surface.

Then I started to think to myself - how do I know if I'm applying too little or too much? I've never seen pics from any forums on this topic. To that end, can someone take 2 pics for me: 1) size of the as5 drop on the hsf
2) as5 spread on the hsf?

This time around, I'm going with Shin-itsu paste. Does the application vary using this compound?

Any input would be great!

thx

 

[Atif]

I believe they've got some diagrams on here:

http://www.arcticsilver.com/ar...ilver_instructions.htm

Peace

 

[nullpointerus]

I thought the company that makes arctic silver had detailed instructions on their website.

I have *no* idea what Shin-itsu paste is, but I'd imagine the amount used would be the same.

Heatsinks can be attached without any thermal compound.* The whole point is to transfer heat, which is what two flat pieces of metal generally do quite well. The point of the thermal compound is to ensure thermal transfer when the two pieces of metal (the chip's heat spreader and the HSF) are uneven and/or coarse. In other words, the thermal compound just "fills in the gaps."

The thinnest possible layer you could make with a flat object would likely be "enough."Additional paste is wasted, and this can be overdone to the point of actually *hindering* heat transfer. IIRC, some recent Apple laptops kept overheating through factory overapplication of thermal compound. A pea-sized amount is generally fine, but I would err towards small peas.



I've seen two basic types of thermal compound: paste and the silver stuff. The former you should apply very simply because it's gooey and messy as heck--like marshmallow creme. The latter you should follow the Arctic Silver's directions of cleaning the HSF/chip and rubbing a super-thin amount onto the HSF/chip to work the stuff into the grooves because the stuff is more like wet sand.

Good luck!


* I really wouldn't attach a HSF without thermal compound of some kind.